In-Situ Printed Sensor Integration on IC Die After PCB Soldering
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Solution Overview
Problem
Sensors integrated with integrated circuits are often compromised by high-temperature soldering processes in surface mounting, leading to damage and increased physical distance between sensors and signal processing apparatus, which degrades signal-to-noise ratio and requires costly secondary attachment processes.
Innovation Solution
A method involving mounting an integrated circuit die on a printed circuit board using a high temperature process, followed by encapsulation with an opening to expose electrical contacts, allowing for direct printing of sensors onto the IC die after soldering is complete, thereby establishing an electrical connection between the IC and the sensor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sensors are mounted using high-temperature soldering processes, then electrical connection between sensor and PCB is achieved, but the sensor is damaged due to temperature sensitivity
Solution Approach 1:
The sensor is mounted on the IC die before the high-temperature soldering process. This preliminary action allows the sensor to be positioned and connected to the IC die at low temperature, avoiding exposure to damaging soldering temperatures. The sensor-IC die assembly is then treated as a single unit during subsequent high-temperature PCB soldering.
2Measurement precision
If sensors are mounted before soldering, then signal-to-noise ratio is improved due to reduced physical distance, but secondary attachment processes are required increasing cost and time
Solution Approach 1:
The sensor mounting process is merged with the IC die packaging process. The sensor is mounted on the IC die and both are encapsulated together in a single packaging operation, eliminating the need for separate secondary attachment processes. This integration maintains the close physical distance between sensor and IC for optimal signal-to-noise ratio while streamlining manufacturing into one continuous process.
3Length of moving object
If sensors are mounted before soldering, then physical distance between sensor and IC is reduced, but the sensor is damaged by high-temperature soldering processes
Solution Approach 1:
The sensor is mounted on the IC die before the high-temperature soldering process. This preliminary action allows the sensor to be positioned and connected to the IC die at low temperature, avoiding exposure to damaging soldering temperatures. The sensor-IC die assembly is then treated as a single unit during subsequent high-temperature PCB soldering.
4Reliability
If sensors are mounted after soldering, then sensor integrity is maintained, but physical distance between sensor and IC increases decreasing signal quality
Solution Approach 1:
The sensor is mounted on the IC die before the high-temperature soldering process. This preliminary action allows the sensor to be positioned and connected to the IC die at low temperature, avoiding exposure to damaging soldering temperatures. The sensor-IC die assembly is then treated as a single unit during subsequent high-temperature PCB soldering.
Data Source
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Figure 3A~3B
Figure 4A~4B
AI summary
The present disclosure teaches a method for manufacturing a module comprising an integrated circuit and a sensor. The method may comprise: mounting an integrated circuit (IC) die on a printed circuit board (PCB) using a high temperature process to provide an electrical connection between interconnects of the PCB and the die; and printing a sensor directly onto the module after all high temperature mounting processes are complete.