Printed Sensor Patch for Greenhouse Micro-Climate Monitoring

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Solution Overview

Problem

Current smart agriculture systems lack efficient methods for real-time monitoring of plant status information during growth, transportation, and storage, particularly in greenhouses, which limits accurate irrigation management and crop production.

Innovation Solution

A printed sensor patch with a substrate, data acquisition system, and sensor array including moisture, humidity, temperature, and volatile organic compound sensors, designed for insertion into soil and ambient environment monitoring, utilizing nanomaterial-based electrodes and inkjet printing technology for cost-effective deployment.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If traditional sensor systems are used for micro-climate monitoring, then measurement capability is provided, but device complexity and cost increase

Engineering Contradiction:
Improvemicro-climate monitoring accuracyVSAvoidsystem complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

Multiple sensors (moisture, humidity, temperature, VOC) are integrated into a single printed patch device, combining multiple measurement functions into one unified system that monitors both soil conditions and ambient micro-climate simultaneously

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The printed sensor patch serves multiple functions: it monitors soil moisture, ambient humidity, temperature, and volatile organic compounds, providing comprehensive micro-climate data for greenhouse environments through a single multi-functional device

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Productivity

If comprehensive sensor arrays are deployed for real-time monitoring, then productivity and crop production improve, but manufacturing cost and deployment complexity increase

Engineering Contradiction:
Improvecrop production efficiencyVSAvoidmanufacturing cost
Core Design Contradiction:
ProductivityVSEase of manufacture

Solution Approach 1:

Traditional mechanical sensor assembly and wiring is replaced with inkjet printing technology that directly deposits functional materials and conductive traces onto the substrate, enabling low-cost, scalable manufacturing of complete sensor devices

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The manufacturing approach transitions from discrete component assembly to continuous printing processes, changing the production parameter from mechanical assembly time to printing speed and material deposition rate, enabling faster and cheaper manufacturing

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Enables real-time, accurate monitoring of soil moisture, humidity, temperature, and VOCs, optimizing irrigation and reducing labor costs while enhancing crop production and detecting spoilage, with rapid data processing and transmission.

Implementation Method 1

the moisture level sensor is configured to monitor a soil water level

Methodology Applied
Scientific EffectElectrical resistance measurement: Electrical Resistance

Implementation Method 2

the humidity sensor is configured to monitor a humidity level

Methodology Applied
Scientific EffectElectrical resistance measurement: Electrical Resistance

Implementation Method 3

the temperature sensor is a resistive temperature detector configured to monitor a temperature

Methodology Applied
Scientific EffectResistive temperature detection: Thermistor

Implementation Method 4

the volatile organic compound sensor is configured to identify a volatile organic compound

Methodology Applied
Scientific EffectElectrical resistance measurement: Electrical Resistance

Data Source

PatentUS20240369526A1Integrated printed sensor patch for micro-climate monitoring of greenhouse and soil-related variables
Publication Date: 2024.11.07 HAMAD BIN KHALIFA UNIVERSITY
  • US20240369526A1 patent drawing
  • US20240369526A1 patent drawing
  • US20240369526A1 patent drawing

AI summary

A printed sensor patch for micro-climate monitoring is provided. The printed sensor patch includes a substrate having a first portion and second portion, a data acquisition system, and a sensor array. The sensor array includes a moisture level sensor, a humidity sensor, a temperature sensor, and a volatile organic compound sensor.