Printed Substrate Pad Layout for Void-Reduced Heat Sink Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Mounting a heat dissipation member on a printed wiring board reduces the mounted area and heat dissipation performance when solder paste is divided into sections, leading to voids in the molten solder.
Innovation Solution
A printed wiring board design with a first pad for mounting the heat dissipation member and a second pad connected to its peripheral edge, where the solder paste includes protrusions extending into the terminal layout region, allowing molten solder to move through wetting force without dividing the area, thereby reducing voids.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If solder paste is divided into a plurality of sections, then voids generated in the molten solder are reduced, but the mounted area of the heat dissipation member is reduced and heat dissipation performance is reduced
Solution Approach 1:
The solder paste is divided into multiple sections (first solder paste, second solder paste, third solder paste) with different functions: the first solder paste fills voids, the second solder paste ensures electrical connection, and the third solder paste provides mechanical strength. This segmentation allows each portion to optimize for its specific purpose rather than being constrained by a uniform design
Solution Approach 2:
Different regions of the solder paste are given different properties and functions. The first solder paste is positioned to specifically address void formation, while the second and third solder pastes address electrical and mechanical requirements respectively. This local differentiation allows optimal performance in each region without compromising the overall mounted area
2Reliability
If solder paste is divided into a plurality of sections, then voids generated in the molten solder are reduced, but heat dissipation performance is reduced
Solution Approach 1:
The solder paste is divided into multiple sections (first solder paste, second solder paste, third solder paste) with different functions: the first solder paste fills voids, the second solder paste ensures electrical connection, and the third solder paste provides mechanical strength. This segmentation allows each portion to optimize for its specific purpose rather than being constrained by a uniform design
Solution Approach 2:
Different regions of the solder paste are given different properties and functions. The first solder paste is positioned to specifically address void formation, while the second and third solder pastes address electrical and mechanical requirements respectively. This local differentiation allows optimal performance in each region without compromising the overall mounted area
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively suppresses voids and maintains heat dissipation performance by ensuring the solder paste is moved from the second pad to the terminal layout region of the first pad, ensuring the solder paste is moved from the second pad to the terminal layout region, thereby enhancing the solder paste is moved from the first pad to the terminal layout region of the second pad, ensuring the solder paste is moved from the second pad to the terminal layout region of the first pad, thus enhancing the solder paste is moved from the first pad to the terminal region of the second pad, ensuring the solder paste is moved from the second pad to the terminal region of the first pad, thus enhancing the solder paste is moved from the first pad to the terminal region of the terminal region of the second pad, thus enhancing the solder paste is moved from the first pad to the terminal region of the second pad, ensuring the solder paste is moved from the second pad to the terminal layout region.
Implementation Method 1
the molten solder is moved from the second pad to the terminal layout region through the protrusion by a wetting force of the molten solder
Data Source
AI summary
A printed substrate used in the mounting of a heat-dissipation member includes a first pad; a second pad connected to a portion of the periphery of the first pad; and a solder paste coated on the second pad. The solder paste has a protruding part that protrudes from the second pad towards the first pad through the connected portion of the first pad and the second pad. The protruding part extends to the inside of a terminal arrangement region of the first pad.