Printed Thermocouple on Flexible Non-Planar Substrate
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Solution Overview
Problem
Conventional thermocouples are not suitable for use on flexible or irregular surfaces, as they are fragile and difficult to apply directly to three-dimensional medical devices, leading to issues with accuracy and reliability in temperature measurement during medical procedures.
Innovation Solution
A thermocouple device is developed with printed metal-containing ink compositions applied to a flexible non-planar substrate, forming a thermocouple junction between two metals with different Seebeck coefficients, allowing for direct and secure attachment to irregular surfaces, enhancing accuracy and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Speed
If conventional thermocouples are made of thin wire pairs to respond quickly to temperature changes, then response speed is improved, but the device becomes fragile and difficult to apply to flexible/irregular surfaces
Solution Approach 1:
The patent applies the thin film principle by depositing thermocouple materials as thin films directly onto flexible catheter surfaces. This maintains the quick response characteristics of thin structures while eliminating the fragility and connection problems of wire-based thermocouples. The thin film integration ensures the sensor becomes part of the catheter structure itself, improving reliability during medical procedures.
2Measurement precision
If conventional thermocouples are joined by connecting dissimilar metal wires, then temperature measurement capability is achieved, but the device complexity and difficulty of application to irregular surfaces increases
Solution Approach 1:
The patent merges the thermocouple sensing function directly into the catheter structure by depositing thermocouple material layers onto the catheter surface. This eliminates separate wire connections and complex assembly steps, reducing device complexity while maintaining accurate temperature measurement capability through direct integration of the thermocouple junction at the catheter tip.
Solution Approach 2:
The patent replaces the mechanical wire-joining system with a thin film deposition system. Instead of physically connecting dissimilar metal wires through mechanical means (soldering, twisting), the invention uses vapor deposition or other thin film techniques to create integrated thermocouple structures, simplifying the manufacturing process and eliminating mechanical connection points that could fail.
3Adaptability or versatility
If silk screening is used to print metals onto flexible objects, then temperature sensing can be applied to flexible surfaces, but the method is limited to two-dimensional or planar surfaces and applies pressure during printing
Solution Approach 1:
The patent replaces the mechanical silk screening printing process with a vapor deposition process. This eliminates the need for physical contact and pressure application during manufacturing, allowing thermocouple materials to be deposited directly onto three-dimensional, irregular catheter surfaces without requiring the surfaces to be planar or accessible to screening meshes.
Solution Approach 2:
The patent transitions from two-dimensional planar printing (silk screening) to three-dimensional surface deposition. The vapor deposition technique can conform to complex catheter geometries including curved surfaces, junctions, and irregular shapes, enabling temperature sensing on the actual three-dimensional structure of the catheter rather than requiring simplified 2D representations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a compact, streamlined, and stable temperature measurement system that is less likely to dislodge from the substrate, offering improved accuracy and reduced complexity in device interconnections, while enabling simultaneous temperature measurement and heating functions.
Implementation Method 1
The second printed thermocouple element comprises a second metal containing ink composition with a Seebeck coefficient sufficiently different from the first metal containing ink composition for the first and second printed thermocouple elements to together produce a thermocouple effect.
Data Source
AI summary
In one aspect, the present invention relates to a thermocouple device comprising a flexible non-planar substrate, a first printed thermocouple element comprising a first metal containing ink composition applied to the flexible non-planar substrate, and a second printed thermocouple element in electrical contact with the first printed thermocouple element making a thermocouple junction. The second printed thermocouple element comprises a second metal containing ink composition with a Seebeck coefficient sufficiently different from the first metal containing ink composition for the first and second printed thermocouple elements to together produce a thermocouple effect. The present application further relates to medical devices comprising the thermocouple and methods of making such devices.