Printed Wiring Board Lamination for Void-Free Dry Film Interfaces
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Solution Overview
Problem
Existing methods for manufacturing printed wiring boards face challenges in preventing voids due to air bubbles forming between seed layers and dry films, leading to defects such as short circuits during electrolytic plating.
Innovation Solution
A laminating system and method that applies simultaneous pressure and heat to the dry film after it is cut to a predetermined size, using a laminating device and pressure application device to dissolve air bubbles within the dry film, ensuring a void-free interface with the seed layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a dry film is laminated on a seed layer using conventional methods, then the dry film can be applied to the seed layer, but air bubbles form between the dry film and seed layer causing voids and short circuits
Solution Approach 1:
The patent applies a preliminary action by cutting the dry film to a predetermined size before applying pressure and heat. This preliminary cutting step ensures that the dry film is properly sized and positioned on the seed layer before the lamination process, preventing air bubble formation and voids that would lead to short circuits during electrolytic plating.
Solution Approach 2:
The patent changes physical parameters by applying both pressure and heat simultaneously to the dry film after cutting. This combination of thermal and mechanical parameters ensures complete adhesion of the dry film to the seed layer, eliminating air bubbles and preventing void formation that would cause short circuits.
2Manufacturing precision
If pressure and heat are applied to the dry film after cutting to predetermined size, then air bubbles are dissolved and voids are prevented, but the process complexity increases
Solution Approach 1:
The patent merges the functions of a laminating device and a pressure application device into a coordinated system. The laminating device applies the dry film while the pressure application device simultaneously applies pressure and heat, combining multiple functions in a unified process flow to achieve void-free interfaces without excessive complexity.
Solution Approach 2:
The patent performs the cutting action before the pressure and heat application. This preliminary cutting to predetermined size ensures that the dry film is properly prepared and positioned, making the subsequent pressure and heat application more effective in eliminating air bubbles and preventing voids.
3Manufacturing precision
If the dry film is cut to a predetermined size before pressure and heat application, then the lamination quality improves, but the manufacturing time increases
Solution Approach 1:
The patent performs the cutting operation as a preliminary action before the pressure and heat application. By cutting the dry film to the predetermined size beforehand, the subsequent lamination process achieves better positioning and adhesion, and the time added by cutting is offset by the improved efficiency of the pressure and heat application step.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively prevents the formation of voids between seed layers and dry films, enhancing the yield of conductor circuit formation by eliminating defects like short circuits.
Implementation Method 1
applying a pressure and heat to the dry film applied onto the seed layer
Implementation Method 2
applying a pressure and heat to the dry film applied onto the seed layer
Data Source
AI summary
A laminating system includes a laminating device including a laminating roll device that applies a dry film onto a seed layer formed on a surface of a resin insulating layer, and a pressure application device positioned such that the pressure application device applies heat and pressure to the dry film.