Printed Wiring Board Plating Leads for Low-Resistance Current Feeding
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Solution Overview
Problem
Existing printed wiring boards face challenges in effectively feeding current during the formation of wirings, particularly in the second electroplating process, where the method of current delivery is unclear.
Innovation Solution
The printed wiring board incorporates plating leads connected to the wirings, allowing for efficient current feeding by connecting at specific positions to maintain low electric resistance values, and in some cases, includes bypass leads to further reduce resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If plating leads are disposed on the base film and connected to the wiring, then current feeding efficiency is improved and electric resistance is reduced, but device complexity increases due to additional components
Solution Approach 1:
The plating lead is merged with the wiring structure by direct connection, combining the function of current supply and wiring into an integrated structure. This reduces the number of separate components while maintaining improved current feeding efficiency and lower electric resistance.
Solution Approach 2:
The plating lead is disposed on the base film in advance before the wiring formation process, preparing the current supply path beforehand. This preliminary positioning enables efficient current delivery during subsequent electroplating operations without requiring additional complex connections.
2Reliability
If plating leads are connected at specific positions to maintain low electric resistance, then conductivity is improved, but manufacturing precision requirements increase
Solution Approach 1:
The plating lead is connected to the wiring at specifically optimized positions where the base film provides favorable electrical characteristics. By selecting local connection points with optimal properties, low electric resistance is achieved without requiring extremely high manufacturing precision across the entire structure.
Solution Approach 2:
The base film itself provides the connection medium and partial conductive path between the plating lead and wiring. This self-service function of the base film reduces the precision requirements for external connection processes, as the base film naturally facilitates the electrical connection at the designated positions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective current feeding, ensuring sufficient voltage is supplied across the entire wiring, thereby maintaining low electric resistance and securing the thickness of the electroplating layer, thus optimizing the wiring's conductivity.
Implementation Method 1
at least one plating lead disposed on the main surface and connected to the wiring
Implementation Method 2
a wiring disposed on the main surface; The wiring has a seed layer disposed on the main surface of the base film, a core disposed on the seed layer, and a shrink layer covering the core
Data Source
AI summary
A printed wiring board includes: a base film having a main surface; a wiring disposed on the main surface; and at least one plating lead disposed on the main surface and connected to the wiring.