Printed Wiring Board Layout for Mixed Fine and Wide Traces
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Solution Overview
Problem
Printed wiring boards face challenges in simultaneously forming wiring lines with both small and large line widths using the semi-additive method, which limits their functionality and configuration, especially when used as components in actuators.
Innovation Solution
A printed wiring board design incorporating a first wiring layer with an average line width of 40 μm or less formed by the semi-additive method and a second wiring layer with an average line width of 50 μm or more formed by the subtractive method, enabling additional functions such as mounting, shielding, and connection while maintaining a simple configuration.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the semi-additive method is used to form wiring lines, then small line widths (40 μm or less) can be achieved, but it is difficult to simultaneously form wiring lines with large line widths (50 μm or more)
Solution Approach 1:
The wiring board is divided into multiple wiring layers, with each layer formed by a different method. The first wiring layer uses the semi-additive method for small line widths (40 μm or less), while the second wiring layer uses the subtractive method for large line widths (50 μm or more). This segmentation allows each layer to be optimized for its specific function without compromise.
Solution Approach 2:
The solution moves from a single-layer approach to a multi-layer approach, adding the dimension of layer stacking. By forming wiring lines in different layers with different line width characteristics, the system achieves both small and large line widths simultaneously, effectively resolving the contradiction through spatial dimensionality.
2Adaptability or versatility
If wiring lines with different line widths are formed to achieve additional functions (mounting, shielding, connection), then functionality is improved, but the configuration becomes more complex
Solution Approach 1:
The second wiring layer with large line widths (50 μm or more) is designed to serve multiple functions simultaneously: mounting components, providing shielding, and establishing connections. This multi-functionality approach allows a single wiring layer structure to fulfill multiple roles, improving versatility without proportionally increasing complexity.
Solution Approach 2:
Multiple functions (mounting, shielding, connection) are merged into the second wiring layer. Instead of creating separate structures for each function, the patent combines them into a unified wiring layer design, achieving functional integration that reduces overall configuration complexity while maintaining versatility.
Data Source
AI summary
The printed wiring board according to an embodiment of the present disclosure comprises: a substrate; a first wiring layer having a first wiring that is disposed directly or indirectly on the substrate; and a second wiring layer having a second wiring that is disposed directly or indirectly on the substrate. The average wire width of the first wiring is 40 μm or less, and the average wire width of the second wiring is 50 μm or more.