Printer Chip Testing Layout for Accurate Short-Circuit Detection
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Solution Overview
Problem
Existing methods for determining chip short-circuit faults in printing devices are prone to errors due to damaged chip functions, leading to incorrect short-circuit check results.
Innovation Solution
A chip design with a testing portion comprising multiple conductive terminals and a grounding terminal, where the testing portion includes line segments that surround and connect to the conductive terminals, allowing for accurate identification of short circuits and functional damage by analyzing output level signals.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a short-circuit check command is transmitted to the chip and the data terminal returns a waveform, then the chip is considered not short-circuited, but when the chip function is damaged, the chip cannot return the expected waveform, leading to incorrect short-circuit check results
Solution Approach 1:
The invention divides the short-circuit detection process into two independent parts: (1) detecting whether terminals are short-circuited by checking electrical connection between terminals, and (2) detecting whether chip functions are damaged by verifying expected response waveforms. This segmentation allows each detection task to be performed independently, avoiding the confusion that occurs when both issues are detected using a single method.
Solution Approach 2:
The invention introduces an intermediary testing mechanism that uses a testing portion with conductive terminals and line segments to detect short circuits between terminals before normal communication begins. This intermediary detection layer separates the short-circuit detection function from the normal data communication function, allowing accurate identification of terminal short circuits independent of chip functional status.
2Object-affected harmful factors
If ink drips to the terminal of the chip or conductive materials are attached to the terminal, then adjacent terminals may be connected causing short-circuit faults, but existing check methods cannot distinguish between short circuits and functional damage
Solution Approach 1:
The invention performs preliminary short-circuit detection by checking electrical connections between terminals using the testing portion before initiating normal chip communication. This preliminary action identifies terminal short circuits caused by ink contamination or conductive material attachment, allowing the system to distinguish these physical connection issues from functional damage that occurs during normal operation.
Solution Approach 2:
The invention replaces the mechanical/physical short-circuit detection method (checking waveform responses during communication) with an electrical connection-based detection method using the testing portion. By using dedicated testing line segments and conductive terminals to detect electrical continuity, the system can identify physical short circuits caused by ink or conductive materials without relying on chip functional responses.
Data Source
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AI summary
A chip short-circuit check method and apparatus, a chip testing method, and a chip and a consumable box are provided. The chip includes a substrate, a grounding terminal, at least two conductive terminals, and a testing portion. The substrate has a first half region and a second half region. The grounding terminal includes a ground wire contact portion configured to be in contact with a stylus of a printer, and located in the first half region. The at least two conductive terminals are located in the second half region and arranged spaced apart from each other. Each conductive terminal includes a contact portion configured to be in contact with the stylus of the printer. The testing portion is located on the substrate and electrically connected to the grounding terminal. The testing portion includes a first testing line segment located between a first conductive terminal and a second conductive terminal.