Printer Cooling Unit Rear Airflow Circuit Design
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Solution Overview
Problem
Existing printing apparatuses lack flexibility in installation due to the need for a side-mounted air inlet for cooling, which restricts installation space and can cause circuit malfunctions from electrically conductive dust attachment during cooling.
Innovation Solution
A printing apparatus design featuring a cooling unit with an inflow portion at the rear, a first flow path, a turn-around flow path, and a second flow path, where the air is turned around to cool the circuit board, with the circuit board positioned within the second flow path, and a fan that directs air through these paths, preventing dust attachment and allowing installation near a wall.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If air inlet is provided on the side surface of the housing, then cooling of the circuit board is achieved, but installation flexibility is reduced and electrically conductive dust may attach to the circuit board
Solution Approach 1:
The air inlet is relocated from the side surface to the rear surface of the housing, changing the spatial dimension of the inlet position. This allows the printing apparatus to be installed close to walls or in narrow spaces while maintaining proper airflow for cooling the circuit board, thus improving installation flexibility without compromising cooling effectiveness
Solution Approach 2:
A dust removal mechanism is introduced as an intermediary component between the air inlet and the circuit board. This mechanism removes electrically conductive dust from the air flow before it reaches the circuit board, preventing dust attachment and circuit malfunctions while still allowing effective cooling airflow
2Temperature
If air is blown directly onto the circuit board for cooling, then cooling efficiency is improved, but electrically conductive dust may attach to terminal portions causing circuit short
Solution Approach 1:
A dust removal mechanism is positioned in the air flow path between the air inlet and the circuit board. This intermediary component removes electrically conductive dust particles from the air before the air reaches the circuit board, preventing dust attachment to terminal portions while maintaining direct cooling airflow onto the circuit board for efficient heat dissipation
Solution Approach 2:
Electrically conductive dust is extracted and removed from the air flow using a dust removal mechanism. This separates the harmful dust particles from the beneficial cooling air flow, allowing the air to continue cooling the circuit board directly while the dust is removed and prevented from reaching the circuit board
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances installation flexibility, minimizes dust-related circuit malfunctions, and maintains printing quality by isolating heat from the printing unit and efficiently dissipating heat using a metal fixing member.
Implementation Method 1
a fan causing the air to flow in from the inlet and also causing the air, which passes through the first flow path, the turn-around flow path, and the second flow path, to flow out from the outlet
Implementation Method 2
a first flow path in which the air flowing in from the inlet flows to a front surface side of the housing; a turn-around flow path causing the air flowing through the first flow path to be turned around to a rear surface side of the housing; a second flow path in which the air turned around in the turn-around flow path flows to the rear surface side
Data Source
AI summary
A printing apparatus includes a power-supply unit, a printing unit, a circuit board (main wired board), and a cooling unit. The main-wired-board cooling unit includes: an inflow portion including an inlet from which air outside of a housing flows in, the inflow portion being disposed on a rear surface of the housing; a first flow path in which the air flowing in flows to a front surface side of the housing; a turn-around flow path causing the air flowing in the first flow path to be turned around to a rear surface side of the housing; a second flow path in which the air turned around flows to the rear surface side; a flow-out portion including an outlet from which the air flowing through the second flow path flows out to an outside of the housing, the out portion being disposed at the rear surface; and a fan (main fan) causing the air to flow in from the inlet and also causing the air passing through each of the flow paths to flow out from the outlet. The main wired board is disposed within the second flow path.