Printer Heat Sink With Slits For Warped Board Contact
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Solution Overview
Problem
In printing apparatuses, warped printed circuit boards due to thermal expansion and high-density mounting can lead to gaps between the board and heat sinks, resulting in inefficient heat dissipation and potential malfunctions.
Innovation Solution
A heat sink with a counter surface featuring slits extending in one direction, allowing it to bend and conform to the board's curvature, reducing the gap and enhancing heat dissipation, while additional slits and bent surfaces increase flexibility and heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a heat sink is attached to a warped board, then heat dissipation is required, but gaps are generated between the heat sink and the board reducing heat transmission efficiency
Solution Approach 1:
The heat sink is designed with a flexible counter surface that can dynamically adapt its shape to match the warped board surface. The slits enable the counter surface to bend and deform, transforming the heat sink from a rigid to a dynamically adaptable structure that maintains contact with the warped board, eliminating gaps and ensuring efficient heat transmission.
Solution Approach 2:
The flexibility of the counter surface is achieved by changing its structural parameters - specifically by introducing slits that modify the surface's mechanical properties. This parameter change allows the counter surface to alter its shape and conform to the warped board, resolving the contradiction between maintaining heat sink attachment and accommodating board warpage.
2Ease of operation
If multiple slits are provided in the counter surface, then ease of bending is improved, but structural integrity may be compromised
Solution Approach 1:
The counter surface is segmented into multiple regions by the slits, which divide the continuous surface into smaller flexible segments. This segmentation allows each region to bend independently while maintaining overall structural integrity, as the slits act as flexible joints that distribute stress rather than creating weak points.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces gaps between the board and heat sink, ensuring efficient heat dissipation and preventing malfunctions by allowing the heat sink to follow the board's curvature and maintain ease of bending, thereby improving operational reliability.
Implementation Method 1
a heat sink including a counter surface that is provided to face a board surface of the board and that has a shape with a length in a first direction being longer than a length in a second direction intersecting the first direction in a plan view, and configured to receive heat generated in the board with the counter surface and dissipate the heat to the outside
Implementation Method 2
a board may become warped by thermal expansion due to a layer configuration of a board or an imbalance in copper foil pattern when an electronic component is soldered by the reflow method, and a board may also become warped due to a difference in thermal expansion between a board and a mounted electronic component after soldering
Data Source
AI summary
A printer includes a board configured to control a printing unit operating in the printer that performs printing on a medium, and a heat sink including a counter surface that is provided to face a board surface of the board and that has a shape with a length in a first direction X longer than a length in a second direction Y intersecting the first direction X in a plan view, and configured to receive heat generated in the board with the counter surface and dissipate the heat to the outside. The counter surface includes a slit penetrating the counter surface and extending in the second direction Y.