Print Head Interconnection Structure With Adhesive-Anchored Contact Pads
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Solution Overview
Problem
Inkjet printers face issues with electrical connection reliability due to moisture sensitivity and mechanical stress, leading to nozzle failures and poor bonding at the interconnection structure, which affects the print head's reliability and performance.
Innovation Solution
A print head design featuring recessed contact pad structures with adhesive anchoring, where the adhesive flows into recesses to form a protrusion, securing the contact pads against mechanical forces, ensuring stable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a flexible electrical connection element is used to connect the droplet jetting device to the controller, then the electrical connections can be made flexible and adaptable, but the electrical connections become sensitive to damage from displacement and pulling forces during production and operation
Solution Approach 1:
The contact pad structure is segmented into distinct functional zones: a bonding area for adhesive attachment, a wider portion for mechanical reinforcement, and a connection area for electrical contact. This segmentation allows each zone to optimize its specific function while working together to resolve the contradiction between flexibility and reliability.
Solution Approach 2:
The wider portion of the contact pad structure acts as a pre-designed reinforcement zone that cushions and distributes pulling forces before they can damage the adhesive bonding area. This beforehand cushioning prevents force concentration at critical bonding points, maintaining connection reliability despite flexible sheet displacement.
2Object-affected harmful factors
If the electrical connections are made sensitive to moisture and ink protection measures are implemented, then the electrical connections are protected against ingress, but the bonding structure becomes more complex and requires additional protective measures
Solution Approach 1:
The bonding structure merges mechanical reinforcement and environmental protection functions into a single integrated design. The wider portion serves dual purposes: reinforcing the bonding mechanically while also acting as a barrier against moisture and ink ingress, thereby reducing overall structure complexity.
Solution Approach 2:
The adhesive bonding structure is designed to perform multiple functions simultaneously: providing mechanical adhesion, distributing mechanical stresses, and protecting against environmental contaminants. This multi-functionality reduces the need for separate protective structures, simplifying the overall design.
3Ease of manufacture
If stud bumps are applied as connecting means for the interconnection structure, then electrical connections can be established, but the bonding reliability is insufficient and connections may disconnect under pulling forces
Solution Approach 1:
The contact pad structure extends in the vertical dimension with a wider portion that protrudes beyond the bonding area. This dimensional extension creates a mechanical leverage advantage, distributing pulling forces over a larger area and preventing disconnection, thereby improving reliability while maintaining ease of manufacture.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances manufacturing yield and operational reliability of inkjet printers by providing secure electrical connections resistant to mechanical stress and moisture, improving the print head's performance and longevity.
Implementation Method 1
an adhesive covering the first and second contact pad structures and securing them together
Data Source
Figure 1~2
Figure 3~4
Figure 5~6(d)
AI summary
The actuator of droplet jetting device is electrically connected to its controller via pressure contact between a first contact pad structure on the droplet jetting device and second contact pad structure on a flexible connection element extending towards the controller. Adhesive is applied to hold the contact pad structures together. The securing together of the contact pad structures is improved by the first contact pad structure comprising a recessed portion as compared to a wider portion, which wider portion is positioned between the recessed portion and the second contact pad structure. A portion of the adhesive is 'trapped' underneath the wider portion and acts as an anchor preventing the contact pad structures from being separated when pulling forces are present in the flexible connection element.