Printhead Manufacturing Using Reactive Ion Etching

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Printheads with polymer nozzle plates face issues such as sinking during lamination, leading to skewed ink ejection and compromised structural rigidity, especially in larger formats, and the laser ablation process is complex and costly with alignment challenges.

Innovation Solution

A method involving a polymeric substrate with a patterned material layer, where etching processes are used to form liquid chambers and nozzle bores, allowing for precise alignment and attachment to a carrier substrate, utilizing dry etching techniques like reactive ion etching for high-fidelity pattern transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If laser ablation is used to form features in the polymer nozzle plate, then the nozzle plate can be manufactured, but the process becomes dirty requiring cleaning steps and increases manufacturing complexity

Engineering Contradiction:
Improvenozzle plate manufacturingVSAvoidfabrication process complexity
Core Design Contradiction:
Ease of manufactureVSDevice complexity

Solution Approach 1:

The invention extracts the problematic laser ablation step from the manufacturing process. Instead of using laser ablation on the polymer nozzle plate, the patent forms features directly in the silicon substrate using standard photolithography and etching, eliminating the need for laser ablation and its associated cleaning steps and complexity

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention replaces the mechanical laser ablation process with a chemical etching process. By using photolithography to define patterns and chemical etchants to remove material, the process becomes cleaner and more compatible with standard microelectronic fabrication techniques

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Ease of manufacture

If the polymer nozzle plate is laminated to the silicon substrate, then the printhead can be assembled, but the polymer plate sinks causing skewed ejection directions

Engineering Contradiction:
Improveprinthead assemblyVSAvoidejection direction alignment
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The invention inverts the traditional approach by forming the nozzle features directly in the silicon substrate rather than in a separate polymer plate. This eliminates the lamination step entirely, as the silicon substrate itself becomes the functional nozzle structure, preventing any sinking or misalignment issues

Inventive Principle:
Principle #13The other way round (Inversion)

Solution Approach 2:

The invention merges the silicon substrate and nozzle plate functions into a single integrated structure. By forming fluid chambers, channels, and nozzles directly in the silicon substrate, the patent eliminates the need for a separate polymer nozzle plate and its associated lamination process

Inventive Principle:
Principle #5Merging (Combining)

3Ease of manufacture

If the polymer nozzle plate is laminated to the silicon substrate, then the printhead can be assembled, but alignment of the polymer nozzle plate to the silicon substrate structures is difficult

Engineering Contradiction:
Improveprinthead assemblyVSAvoidalignment precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The invention segments the manufacturing process into standard microelectronic fabrication steps (photolithography, etching) that are performed directly on the silicon substrate. This allows precise alignment to be achieved through standard photolithographic techniques rather than through mechanical lamination alignment

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The invention performs preliminary patterning of the silicon substrate using photolithography before etching. This preliminary pattern definition ensures precise alignment of the final nozzle structures with the silicon substrate features, as the photolithographic pattern transfer process inherently provides accurate alignment

Inventive Principle:
Principle #10Preliminary action

4Area of stationary object

If the printhead length is increased for page-wide applications, then the coverage area is improved, but the structural rigidity is compromised

Engineering Contradiction:
Improveprinthead coverage areaVSAvoidstructural rigidity
Core Design Contradiction:
Area of stationary objectVSStrength

Solution Approach 1:

The invention changes the material parameter from polymer to silicon, which has inherently higher mechanical strength and rigidity. This allows the printhead to be made longer for page-wide coverage while maintaining the necessary structural rigidity, as silicon can support longer spans without sagging or deforming

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method ensures precise alignment and structural integrity of printheads, reducing costs and complexity by avoiding the issues of polymer nozzle plate sinking and the complexities of laser ablation, while enabling scalable printhead designs.

Implementation Method 1

removing at least some of the polymeric substrate not covered by the patterned material layer using an etching process

Methodology Applied
Scientific EffectEtching:

Implementation Method 2

employing dry etching techniques like reactive ion etching for high-fidelity pattern transfer

Methodology Applied
Scientific EffectReactive ion etching:

Data Source

PatentUS7607227B2Method of forming a printhead
Publication Date: 2009.10.27 EASTMAN KODAK CO
  • US7607227B2 patent drawing
  • US7607227B2 patent drawing
  • US7607227B2 patent drawing

AI summary

A method of manufacturing a printhead includes providing a polymeric substrate having a surface; providing a patterned material layer on the surface of the polymeric substrate; and removing at least some of the polymeric substrate not covered by the patterned material layer using an etching process.