Printhead Substrate Anti-Fuse Integration for Cost Reduction
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Solution Overview
Problem
The manufacturing process of printhead substrates incorporating anti-fuse elements is costly due to the need for additional circuit design to withstand high voltages required for writing information, which increases production steps and costs.
Innovation Solution
Incorporating a DMOS transistor configuration to drive electrothermal transducers and an anti-fuse element, along with a driving unit of MOS transistors, which allows for insulation breakdown and information writing without requiring separate voltage generation, thereby simplifying the manufacturing process and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a circuit is designed to withstand high voltage for writing information in anti-fuse elements, then information writing capability is achieved, but manufacturing cost and process complexity increase
Solution Approach 1:
The patent merges the high-voltage switching function with the standard logic circuit function by using the same MOS transistor structure for both purposes. The anti-fuse element is integrated directly into the logic circuit, allowing the circuit to serve dual functions: normal logic operation and high-voltage information writing, thereby eliminating separate voltage generation circuits and reducing manufacturing complexity
Solution Approach 2:
The MOS transistor structure is designed to be multi-functional, serving both as a standard logic switching element and as a high-voltage switch for anti-fuse programming. The same transistor can operate at low voltage for logic operations and at high voltage for writing information, eliminating the need for specialized high-voltage circuit components
2Adaptability or versatility
If additional circuit design is added to withstand high voltage, then anti-fuse element functionality is achieved, but manufacturing steps increase
Solution Approach 1:
The patent combines the anti-fuse element directly into the existing logic circuit structure, merging the memory function with the logic function. This integration allows the same manufacturing process to produce both logic circuits and programmable memory elements without adding separate fabrication steps
Solution Approach 2:
The anti-fuse element is designed and positioned during the standard logic circuit fabrication process, so that the programmable memory capability is built into the device structure before final assembly. This preliminary integration ensures that no additional high-voltage circuit fabrication steps are required
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient and cost-effective production of printhead substrates by eliminating the need for additional gate insulating film formation steps and allowing for programmable anti-fuse elements, while ensuring reliable information writing and reading.
Implementation Method 1
an electrothermal transducer Rh
Implementation Method 2
a second DMOS transistor configured to write information in the anti-fuse element by causing an insulation breakdown of an insulating film of the MOS structure
Data Source
AI summary
A printhead substrate, comprising an electrothermal transducer configured to heat a printing material, a first DMOS transistor configured to drive the electrothermal transducer, a MOS structure forming an anti-fuse element, a second DMOS transistor configured to write information in the anti-fuse element by causing an insulation breakdown of an insulating film of the MOS structure, and a driving unit consisted of at least one MOS transistor and configured to drive the second DMOS transistor.