Printing Assist Feature Placement Methodology for Semiconductor Mask Layout
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Solution Overview
Problem
Current double patterning technology faces challenges in effectively placing and adjusting printing assist features (PrAFs) within the data decomposition process, particularly for complex two-dimensional layouts, due to the lack of established rules and methods for PrAF placement, which complicates the resolution enhancement in semiconductor manufacturing.
Innovation Solution
A method is developed to place PrAFs in a mask layout by generating parameters, simulating their placement, verifying removability, and adjusting parameters based on simulation results, while considering exposure system variations and optical proximity correction, to ensure proper placement and printability, thereby enhancing the depth of focus and process windows.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If printing assist features (PrAFs) are placed adjacent to critical features to improve depth of focus, then the process window increases, but the features may not be removable in subsequent steps
Solution Approach 1:
The patent applies preliminary action by determining PrAF parameters and verifying removability through simulation before actual mask fabrication. The methodology performs virtual placement and validation of printing assist features in the design phase, ensuring they will be removable in subsequent manufacturing steps, thus preventing manufacturing issues before they occur.
2Productivity
If PrAF parameters are not properly determined, then placement is inefficient, but complex simulation and verification increase process complexity
Solution Approach 1:
The patent performs preliminary determination of PrAF parameters including width, spacing, and placement locations through simulation and verification before actual manufacturing. This advance planning ensures optimal placement efficiency while systematically managing process complexity through structured validation steps.
Solution Approach 2:
The methodology incorporates feedback through simulation results to validate PrAF placement and adjust parameters. The process uses simulation feedback to verify removability and optimize placement, creating a closed-loop system that balances efficiency and complexity through data-driven decision making.
3Manufacturing precision
If PrAFs are placed without systematic methodology, then mask layout is simpler, but resolution enhancement effectiveness decreases
Solution Approach 1:
The patent establishes a systematic methodology that preliminarily determines optimal PrAF parameters through simulation and verification before mask fabrication. This structured approach ensures high resolution enhancement effectiveness by scientifically optimizing placement parameters while organizing complexity into manageable procedural steps.
Data Source
AI summary
Embodiments of the present invention provide a method of placing printing assist features in a mask layout. The method includes providing a design layout having one or more designed features; generating a set of parameters, the set of parameters being associated with one or more printing assist features (PrAFs); adding the one or more PrAFs of the set of parameters to the design layout to produce a modified design layout; performing simulation of the one or more PrAFs and the one or more designed features on the modified design layout; verifying whether the one or more PrAFs are removable based on results of the simulation; and creating a set of PrAF placement rules based on the set of parameters, if the one or more PrAFs are verified as removable. The set of PrAF placement rules may be used in creating a final set of PrAF features to be used for creating the mask layout.