Printing Elastomer-Conductor Patterns for Flexible Wiring

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Existing film-type electrical connection devices have limitations in mass productivity and customizability due to complex manufacturing processes involving sputtering, plating, etching, and laser processing, and lack superior bending resistance and reliability.

Innovation Solution

The electrical connection device is manufactured by forming an elastomer pattern and a conductor pattern through printing, which reduces stress on the conductor pattern during bending and enhances durability, allowing for easier production and improved performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If sputtering, plating, etching, and laser processing are used to manufacture the electrical connection device, then the conductor pattern can be formed with good electrical properties, but the manufacturing process becomes complex and mass productivity decreases

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidmass productivity
Core Design Contradiction:
ReliabilityVSProductivity

Solution Approach 1:

The patent replaces complex mechanical manufacturing processes (sputtering, plating, etching, laser processing) with a printing process. The conductor pattern is formed by printing conductive material directly onto the insulating film, eliminating the need for multiple sequential mechanical steps while maintaining electrical connection reliability and significantly improving mass productivity.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

2Reliability

If sputtering, plating, etching, and laser processing are used to manufacture the electrical connection device, then the conductor pattern can be formed with good electrical properties, but the manufacturing process becomes complex and customizability decreases

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidcustomizability
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The printing process allows for easy customization of conductor patterns by simply changing the printing template or design file, without requiring reconfiguration of complex mechanical equipment. This maintains electrical connection reliability while dramatically improving adaptability to different design requirements.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Reliability

If the conductor pattern is formed through complex manufacturing processes, then electrical connection can be achieved, but bending resistance and durability are insufficient

Engineering Contradiction:
Improveelectrical connection reliabilityVSAvoidbending resistance
Core Design Contradiction:
ReliabilityVSStrength

Solution Approach 1:

The patent uses a composite structure where conductive material is printed onto an insulating film, creating an integrated conductor-insulator system. This composite approach provides both electrical connection reliability and improved bending resistance, as the printed conductor pattern flexes with the substrate without the rigid constraints of previously deposited metal layers.

Inventive Principle:
Principle #40Composite materials

Data Source

PatentUS11570893B2Electrical connection device, method for producing the same, and structure of flexible wiring board
Publication Date: 2023.01.31 JAPAN AVIATION ELECTRONICS IND LTD
  • US11570893B2 patent drawing
  • US11570893B2 patent drawing
  • US11570893B2 patent drawing

AI summary

In an electrical connection device in which an adhesive layer is disposed on a flexible base and a conductor pattern is provided on the adhesive layer, an elastomer pattern obtained by curing an ink containing an elastomer composition is formed on the adhesive layer, the conductor pattern obtained by curing an ink containing a conductive particle is formed on the elastomer pattern, and a longitudinal elastic modulus of the elastomer pattern is set to be larger than a longitudinal elastic modulus of the adhesive layer.