Printing Element Board Multiple Data Processing Circuits
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Solution Overview
Problem
Conventional printing element board configurations with a single data processing circuit are inadequate for meeting demands for increased image quality and functionality due to complex layouts, long wiring, and limited communication passages, which result in inefficient temperature control and reduced ejection frequency.
Innovation Solution
A printing element board design featuring multiple data processing circuits and PAD arrays, with individual wiring systems between the printing element arrays and PAD arrays, allowing for reduced wire resistance, improved layout, and increased communication efficiency through multiple communication passages.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single data processing circuit is used to control all sub-heaters, then the device complexity is reduced, but the wiring becomes long and layout becomes complicated
Solution Approach 1:
The data processing circuit is divided into multiple independent systems (first data processing circuit and second data processing circuit). Each circuit system controls a specific group of sub-heaters, segmenting the control function to reduce wiring length and simplify layout while maintaining comprehensive temperature control capability
2Device complexity
If a single communication passage is used for data input, then the device complexity is reduced, but the data transfer frequency decreases when driving large numbers of sub-heaters
Solution Approach 1:
The communication passage is segmented into multiple independent channels (first communication passage and second communication passage). Each communication passage handles data for specific sub-heater groups in parallel, enabling simultaneous data transmission and significantly increasing the overall data transfer frequency for controlling large numbers of sub-heaters
3Reliability
If wiring length is reduced by using multiple data processing circuits, then wire resistance decreases, but the device complexity increases
Solution Approach 1:
The control system is segmented into multiple data processing circuits, each handling a specific spatial region of sub-heaters. This segmentation naturally reduces the maximum wiring length from each circuit to its controlled sub-heaters, decreasing wire resistance and improving reliability while the modular structure keeps the overall system complexity manageable
Solution Approach 2:
Each data processing circuit is locally optimized to control a specific group of sub-heaters in its vicinity. This local control approach minimizes wiring length for each circuit-sub-heater connection, reducing wire resistance locally while the distributed architecture maintains overall system functionality
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances temperature control uniformity, increases the frequency of nozzle driving, and improves image quality by reducing wire resistance and layout complexity, enabling more efficient data transfer and sub-heater control.
Implementation Method 1
a heat generating element configured to heat the liquid
Data Source
AI summary
One embodiment of the present invention is a printing element board including a plurality of printing elements configured to eject a liquid, the plurality of printing elements being arrayed in a first direction to form a printing element array; a heat generating element configured to heat the liquid; a driver configured to drive the heat generating element; a data processing circuit configured to control the driver; and a plurality of PADs configured such that a signal to be sent to the data processing circuit is inputted to the plurality of PADs from outside, the plurality of PADs being arrayed in the first direction to form a PAD array, wherein the data processing circuit is provided in at least two or more systems between the printing element array and the PAD array in a second direction orthogonal to the first direction.