Printing LED and PV Diodes via Low-Temp Coating
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Solution Overview
Problem
Current methods for manufacturing LED-based lighting devices and photovoltaic panels are labor-intensive and expensive, making them costly for widespread consumer adoption, with existing technologies facing challenges in reducing material and manufacturing costs.
Innovation Solution
The development of LED-based lighting devices and photovoltaic devices using printing and coating technologies, which allow for the creation of devices in various sizes, operating under diverse conditions, with low-temperature processing and in-situ diode formation, eliminating the need for individually placed finished diodes and reducing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional integrated circuit process steps are used to manufacture LEDs on semiconductor wafers, then manufacturing precision and reliability are improved, but labor intensity and manufacturing cost increase significantly
Solution Approach 1:
The patent replaces traditional mechanical integrated circuit fabrication processes with a chemical solution-based approach. Liquid precursors are deposited onto flexible substrates and converted to functional LED components through chemical reactions and low-temperature processing, eliminating the need for complex mechanical photolithography and high-temperature semiconductor manufacturing equipment.
Solution Approach 2:
The invention fundamentally changes the processing temperature parameter from high-temperature semiconductor manufacturing (typically >1000°C) to low-temperature flexible substrate processing (<200°C). This parameter change enables LED fabrication on flexible, cost-effective substrates while maintaining device functionality and significantly reducing manufacturing complexity.
2Reliability
If individual LEDs are placed in reflective casings with bonding wires, then device reliability is improved, but productivity decreases and cost increases
Solution Approach 1:
The patent merges multiple discrete manufacturing steps (LED fabrication, casing formation, wire bonding) into a single integrated low-temperature processing sequence. The reflective casing and electrical connections are formed as part of the same deposition and processing cycle, eliminating sequential assembly operations and dramatically improving productivity.
Solution Approach 2:
The reflective casing and electrical conductors are formed preliminarily during the LED fabrication process itself, rather than as separate post-processing steps. This preliminary integration of structural and electrical components reduces the total number of manufacturing operations required.
3Use of energy by moving object
If photovoltaic panels are manufactured using traditional methods, then energy conversion efficiency is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent replaces complex mechanical photovoltaic cell fabrication with a simplified chemical deposition process. Liquid precursors containing photovoltaic materials are deposited and converted through low-temperature processing, creating functional photovoltaic devices without requiring complex semiconductor manufacturing equipment and multi-step mechanical assembly processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in robust, cost-effective LED-based lighting devices and photovoltaic panels that can be widely adopted, offering reduced production costs and improved efficiency through mode coupling and wider angle light incidence without the need for separate tracking systems.
Implementation Method 1
a plurality of substantially spherical lenses having at least a first index of refraction, the plurality of substantially spherical lenses suspended in a first polymer having at least a second, different index of refraction
Implementation Method 2
subsequent to the coupling to the at least one first conductor, converting the plurality of substantially spherical substrate particles into a plurality of substantially spherical diodes
Implementation Method 3
converting the plurality of substantially spherical substrate particles into a plurality of substantially spherical diodes
Data Source
AI summary
The present invention provides an electronic apparatus, such as a lighting device comprised of light emitting diodes (LEDs) or a power generating apparatus comprising photovoltaic diodes, which may be created through a printing process, using a semiconductor or other substrate particle ink or suspension and using a lens particle ink or suspension. An exemplary apparatus comprises a base; at least one first conductor; a plurality of diodes coupled to the at least one first conductor; at least one second conductor coupled to the plurality of diodes; and a plurality of lenses suspended in a polymer deposited or attached over the diodes. The lenses and the suspending polymer have different indices of refraction. In some embodiments, the lenses and diodes are substantially spherical, and have a ratio of mean diameters or lengths between about 10:1 and 2:1. The diodes may be LEDs or photovoltaic diodes, and in some embodiments, have a junction formed at least partially as a hemispherical shell or cap.