Printing Plate Recessed Pattern Width Compensation
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Solution Overview
Problem
Existing methods for forming fine patterns in flat panel displays, such as photolithography and screen printing, face challenges in production efficiency and precision, particularly due to the isotropic etching of wet processes which widen recessed patterns, making it difficult to achieve desired interconnections with both fine dimensions and adequate corrosion resistance.
Innovation Solution
A printing plate with a recessed pattern and a compensation layer is used, where a metal layer is formed on a substrate, etched to create a recessed pattern, and then a compensation layer is applied to adjust the pattern width without altering its shape, allowing for precise and fine pattern formation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If wet etching is used to form a recessed pattern, then the etching process is simple and fast, but the isotropic etch characteristic causes the width of the recessed pattern to increase, reducing manufacturing precision
Solution Approach 1:
The patent changes the etching parameters by introducing an anisotropic etching process that etches vertically at a different rate than laterally, thereby controlling the recessed pattern width to be less than twice the depth. This parameter change resolves the contradiction by maintaining etching efficiency while achieving the desired width precision.
Solution Approach 2:
The patent applies a compensation layer to the substrate before forming the recessed pattern. This preliminary action compensates for the expected width increase caused by isotropic etching, allowing the final recessed pattern to achieve the desired width precision even when using efficient wet etching processes.
2Manufacturing precision
If the recessed pattern depth is decreased to reduce width, then the width decreases, but the thickness of the resist pattern becomes small, reducing corrosion resistance
Solution Approach 1:
The patent changes the relationship between recessed pattern depth and width by implementing anisotropic etching with a vertical-to-lateral etch rate ratio greater than 1:2. This allows the recessed pattern to maintain adequate depth for corrosion resistance while achieving the desired narrow width, resolving the contradiction between these two parameters.
3Manufacturing precision
If photolithography is used to form fine resist patterns, then fine patterns can be formed, but complex processes such as exposure and development are required, reducing production efficiency
Solution Approach 1:
The patent extracts and eliminates the complex exposure and development processes from the photolithography sequence by using a simplified printing plate-based method. The printing plate directly transfers the fine pattern design to the resist layer through a single printing step, achieving fine pattern formation while dramatically improving production efficiency.
4Productivity
If screen printing is used to form resist patterns, then production efficiency is excellent, but the resist pattern thickness is several ten micrometers, making it difficult to form complicated and fine patterns
Solution Approach 1:
The patent merges the advantages of screen printing (production efficiency) with the fine pattern formation capability of photolithography by using a printing plate that incorporates precise fine pattern designs. The printing process maintains high efficiency while the plate design enables formation of complicated and fine patterns with much smaller dimensions than conventional screen printing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables the formation of fine and precise interconnections in flat panel displays, improving production efficiency and corrosion resistance by compensating for the width of recessed patterns, thus facilitating the creation of complex circuits.
Implementation Method 1
when a recessed pattern is formed by wet etching a substrate, a CD-bias of the recessed pattern occurs due to an isotropic etch characteristic of the wet etching
Data Source
AI summary
A method of fabricating a printing plate includes: preparing a substrate; forming a metal layer on an entire surface of the substrate; forming a resist pattern on the metal layer, the resist pattern having a fine pattern exposing a portion of the metal layer; wet etching the exposed metal layer, and removing the resist pattern to form a metal layer pattern exposing a portion of the substrate; wet etching the exposed substrate, and removing the metal layer pattern to form a recessed pattern; and forming a compensation layer on an entire surface of the substrate where the recessed pattern is formed.