Probe Alignment During Thermal Cycling
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Solution Overview
Problem
Probe systems face challenges in maintaining alignment between a probe and a device under test during temperature changes, leading to increased manufacturing costs, reduced packing density, and inaccurate manual adjustments.
Innovation Solution
The system automatically maintains planar and height alignments by collecting images of fiducials, determining offsets, and adjusting the probe's location using a controller and thermal module, ensuring precise alignment without manual input.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If contact pads are made larger to accommodate orientation changes during temperature variation, then alignment tolerance is improved, but manufacturing cost increases and packing density decreases
Solution Approach 1:
The patent changes the parameter of contact pad size from large to small, and introduces active temperature control parameters to compensate for thermal expansion effects, thereby maintaining alignment precision without requiring larger contact pads
Solution Approach 2:
The patent implements dynamic temperature control of the probe system to actively compensate for thermal expansion and contraction during operation, allowing the system to adapt to temperature changes while maintaining precise alignment with smaller contact pads
2Manufacturing precision
If manual adjustment is used to maintain alignment during temperature change, then alignment is maintained, but time consumption increases and accuracy decreases
Solution Approach 1:
The patent implements self-service through automated temperature control and alignment compensation mechanisms that actively maintain probe-to-contact-pad alignment without requiring manual intervention, thereby improving both accuracy and reducing time consumption
Solution Approach 2:
The patent employs feedback mechanisms through temperature sensors and alignment detection systems that continuously monitor conditions and automatically adjust the probe position or contact pad positioning to maintain optimal alignment during temperature variations
3Reliability
If larger contact pads are used to accommodate thermal expansion, then alignment is maintained, but packing density of integrated circuit devices decreases
Solution Approach 1:
The patent changes the approach from static large contact pads to dynamic temperature-controlled small contact pads, allowing precise alignment maintenance through active compensation rather than oversized structures, thereby enabling higher packing density
Solution Approach 2:
The patent transforms the static contact pad design into a dynamic system with active temperature control, allowing the probe system to adapt to thermal changes and maintain reliable alignment with smaller contact pads, thus improving packing density
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach reduces wear on probes and contact pads, maintains alignment to a stricter tolerance, and decreases the contact area, thereby improving testing accuracy and efficiency.
Implementation Method 1
thermal expansion and/or contraction experienced by the probe system and/or by the wafer may cause such orientation changes
Data Source
AI summary
Probe systems and methods for automatically maintaining alignment between a probe and a device under test (DUT) during a temperature change. The methods include collecting an initial image of a planar offset fiducial and determining an initial height reference of a height offset fiducial. The methods further include changing a temperature of the DUT, automatically maintaining a planar alignment between a probe and the DUT during the changing, and automatically maintaining a height alignment between the probe and the BUT during the changing. The probe systems include a chuck, which defines a support surface configured to support a substrate that includes the DUT, and a probe head assembly, which includes a probe configured to contact a corresponding contact pad of the DUT. The probe systems further include a substrate thermal module, which is configured to regulate a temperature of the DUT, and a controller programmed to execute the methods.