Probe Apparatus Switching Measurement Lines for Dynamic Testing

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Solution Overview

Problem

Conventional probe apparatuses face challenges in accurately measuring dynamic characteristics of power devices due to the inductance of the measurement line, which interferes with the measurement process, leading to production yield issues and defective products.

Innovation Solution

A probe apparatus with a movable mounting table and a probe card featuring separate measurement lines for static and dynamic characteristics, where a switch device is used to isolate the second measurement line during dynamic characteristic measurement, reducing the impact of inductance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If a single measurement line is used for both static and dynamic characteristics measurement, then device complexity is reduced, but measurement precision deteriorates due to inductance interference in dynamic characteristics measurement

Engineering Contradiction:
Improvemeasurement line configurationVSAvoiddynamic characteristics measurement accuracy
Core Design Contradiction:
Device complexityVSMeasurement precision

Solution Approach 1:

The measurement system is segmented into two separate measurement lines: a first measurement line for dynamic characteristics measurement and a second measurement line for static characteristics measurement. This segmentation allows each measurement line to be optimized for its specific measurement type, eliminating the inductance interference problem that affects dynamic characteristics when using a shared measurement line.

Inventive Principle:
Principle #1Segmentation

2Measurement precision

If the second measurement line is isolated during dynamic characteristics measurement, then measurement precision of dynamic characteristics is improved, but device complexity increases due to the switch device

Engineering Contradiction:
Improvedynamic characteristics measurement accuracyVSAvoidmeasurement line control system
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The switch device is configured to isolate the second measurement line from the conductive film electrode before dynamic characteristics measurement begins. This preliminary isolation action prevents inductance interference from affecting the dynamic characteristics measurement, ensuring high measurement precision while maintaining a relatively simple device structure.

Inventive Principle:
Principle #10Preliminary action

3Reliability

If a conventional probe apparatus is used for power device measurement, then static characteristics can be measured, but dynamic characteristics measurement is not achievable leading to production yield deterioration

Engineering Contradiction:
Improveproduction yieldVSAvoidmeasurement capability
Core Design Contradiction:
ReliabilityVSAdaptability or versatility

Solution Approach 1:

The probe apparatus is designed with multi-functionality to measure both static and dynamic characteristics of power devices at the wafer level. The first measurement line enables dynamic characteristics measurement while the second measurement line enables static characteristics measurement, allowing the same apparatus to perform both measurement types without requiring separate testing equipment.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentEP2746794B1Probe apparatus
Publication Date: 2016.10.05 TOKYO ELECTRON LTD
  • EP2746794B1 patent drawingFigure 1
  • EP2746794B1 patent drawingFigure 2
  • EP2746794B1 patent drawingFigure 3

AI summary

A probe apparatus can measure both of static characteristics and dynamic characteristics of a power device at a wafer level and, particularly, can surely measure dynamic characteristics of a power device at a wafer level without being affected by a measurement line that measures static characteristics. The probe apparatus 10 has a movable mounting table 12 that mounts a wafer W on which multiple power devices are formed; a probe card 14 that is provided above the mounting table 12 and has multiple probes 14A; a conductive film electrode 13 formed on a mounting surface of the mounting table 12 and an outer peripheral surface thereof; and a measurement line 16 that electrically connects the conductive film electrode 13 to a tester 17. Further, the probe apparatus measures electrical characteristics of the power devices on the mounting table 12 at a wafer level. Furthermore, a second measurement line 16 includes a switch device 18 configured to open and close an electric path of the measurement line 16 between the conductive film electrode 13 and the tester 17.