Miniaturized Probe Array Connector for Dense Transducer Interconnection
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Solution Overview
Problem
There is a challenge in miniaturizing the connection between dense transducer arrays and cable assemblies while maintaining a reduced cross-sectional size, which is essential for medical and other applications where space is limited, and existing solutions are not commercially practical.
Innovation Solution
The development of an array connector with stacked substrate layers forming channels for communication lines, allowing for high-density terminal arrays and efficient signal transmission, using methods such as thermo-compression bonding or anisotropic conductive films, to connect dense arrays of sensing elements like CMUTs or PMUTs to cable assemblies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a dense transducer array with high element density (e.g., 1000 sensing elements/cm²) is used to achieve high-quality imaging, then imaging quality and data throughput are improved, but the cross-sectional size of the catheter and cable assembly increases, making insertion into the patient's body difficult
Solution Approach 1:
The patent transitions from planar 2D transducer arrays to three-dimensional volumetric arrays of sensing elements. By arranging elements in 3D space along the catheter length and circumference, the system achieves higher element density without increasing the catheter's cross-sectional footprint, enabling real-time 3D imaging while maintaining insertability into the patient's body
Solution Approach 2:
The patent implements a nested structure where multiple layers of flexible circuit boards are stacked concentrically around the catheter core, with transducer elements arranged in nested cylindrical patterns. This nesting approach allows high-density element placement within a compact cross-sectional area, fitting numerous sensing elements within the constrained spatial envelope of the catheter
2Productivity
If the number of communication lines is increased to support dense transducer arrays, then data throughput is improved, but the cable assembly size and complexity increase
Solution Approach 1:
The patent combines multiple communication functions into integrated flexible circuit board assemblies that serve both structural support and signal transmission roles. The FPCBs integrate transducer element connections, signal routing, and data aggregation into unified layers, reducing the need for separate cable components and simplifying the overall cable assembly while maintaining high data throughput capability
Solution Approach 2:
The patent utilizes the third dimension (catheter length) to distribute communication lines along the longitudinal axis rather than concentrating them in a single plane. This spatial distribution allows multiple communication channels to be routed through different catheter segments and FPCB layers, achieving high data throughput without increasing cross-sectional cable complexity
3Measurement precision
If conventional piezoelectric transducer probes are replaced with CMUT or PMUT probes fabricated using MEMS techniques, then transducer performance and imaging capability are improved, but manufacturing complexity and cost increase
Solution Approach 1:
The patent divides the transducer array into modular segments that can be independently fabricated using MEMS techniques and then assembled into the complete catheter system. This segmentation allows standardization of manufacturing processes for each module, reducing overall manufacturing complexity while maintaining the high performance benefits of CMUT/PMUT technology
Solution Approach 2:
The patent employs systematic parameter optimization in the MEMS fabrication process, including standardized membrane thicknesses, electrode geometries, and material compositions. By establishing controlled parameter ranges and tolerance specifications, the system achieves consistent transducer performance across production batches, reducing manufacturing variability and cost
4Volume of moving object
If the catheter and cable assembly are miniaturized to reduce cross-sectional size, then insertability is improved, but the ability to interconnect dense transducer arrays and cable assemblies becomes more difficult
Solution Approach 1:
The patent uses flexible printed circuit boards as thin-film interconnection media that can be bent and routed within the constrained catheter geometry. These flexible circuits provide reliable electrical connections between miniaturized transducer elements and the cable assembly while accommodating the compact spatial arrangement required for small cross-sectional dimensions
Solution Approach 2:
The patent implements modular connection interfaces that segment the interconnection system into discrete, standardized components. This segmentation enables simplified assembly of dense transducer arrays with miniaturized cable assemblies through standardized mating connectors, reducing interconnection complexity despite the reduced overall system size
Data Source
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AI summary
Probe assembly (650) includes a modular device (670) configured to detect external signals or emit energy. The modular device (670) has a device array (676) that includes at least one of electrical contacts or optical fiber ends. The probe assembly (650) also includes a cable assembly (652) that is configured to communicatively couple the modular device (670) to a computing system (554) and transmit data signals therethrough. The cable assembly (652) includes an array connector (654) having a connector body (660) that includes a mating side (662) and channels (246) extending through the mating side (662) and the connector body (660). The cable assembly (652) includes a plurality of communication lines (656) that are disposed within corresponding channels (246) of the connector body (660). The communication lines (656) have respective end faces (415) that are positioned proximate to the mating side (662) to form a terminal array (114). The terminal array (114) is aligned with and coupled to the device array (676) of the modular device (670).