Probe Assembly Cooling for Power Semiconductor Inspection
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Solution Overview
Problem
Existing probe systems for inspecting power semiconductor devices face challenges in accurately measuring electrical characteristics due to temperature drift caused by large electric currents, leading to potential device damage and increased waste and costs from faulty final inspections.
Innovation Solution
A probe assembly featuring a probe block with high thermal and electric conductivity, which acts as a heat sink, is used to cool both the probes and the semiconductor device by jetting a cooling medium towards it, ensuring accurate measurements during large current inspections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If large electric current is applied to inspect power semiconductor devices in wafer or chip state, then accurate measurements of electrical characteristics can be obtained, but temperature drift occurs and semiconductor devices or inspection probes may be damaged
Solution Approach 1:
The patent applies preliminary cooling action by equipping the probe card with a cooling pipe through which cooling medium flows before the inspection process. This pre-cooling prevents temperature rise caused by large electric current during inspection, thereby avoiding temperature drift and device damage while maintaining measurement accuracy
Solution Approach 2:
The patent introduces a cooling medium as an intermediary substance that flows through the cooling pipe in the probe card. This cooling medium acts as a heat transfer mediator, absorbing excess heat generated during large current inspection and preventing it from affecting the semiconductor device and probes, thus resolving the temperature drift problem
2Object-affected harmful factors
If small electric current is applied for rough selection inspection, then temperature drift is avoided, but characteristic faults are frequently found in final full-spec inspection after packaging
Solution Approach 1:
The patent enables preliminary large-current inspection by providing cooling capability before inspection occurs. This allows rough selection to be performed with large electric current that simulates actual operating conditions, preventing characteristic faults from being missed while avoiding temperature drift through the cooling system
Solution Approach 2:
The patent changes the inspection parameter from small current to large current by providing thermal management through the cooling pipe. This parameter change allows inspection conditions to match actual operating conditions, improving detection of characteristic faults while the cooling system prevents temperature-related problems
3Strength
If cooling means is equipped in probe card to cool the probe card, then probe card melting is prevented, but probes and semiconductor device are not sufficiently cooled
Solution Approach 1:
The patent uses cooling medium flowing through the cooling pipe as an intermediary heat transfer substance. This medium directly contacts the probes and semiconductor device, efficiently removing heat from these critical components rather than just cooling the probe card structure indirectly
Solution Approach 2:
The patent employs a hydraulic cooling system with cooling medium flowing through the cooling pipe to achieve direct thermal contact with the probes and device. This fluid-based cooling method is more effective than air cooling or indirect conduction for removing heat from the inspection probes and semiconductor device
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively suppresses temperature rises in probes and semiconductor devices, enabling accurate inspections under conditions closer to actual performance, reducing the frequency of faults found in final inspections and minimizing product waste and costs.
Implementation Method 1
A probe assembly featuring a probe block with high thermal and electric conductivity, which acts as a heat sink
Implementation Method 2
probe block with high thermal and electric conductivity, which acts as a heat sink
Implementation Method 3
cooling both the probes and the semiconductor device by jetting a cooling medium towards it
Data Source
AI summary
A probe assembly for inspecting power semiconductor devices, which includes a probe block having more than one probe holding hole, more than one probe, each of which is contained in one of the probe holding holes with its outer surface being in contact with the inner surface of the probe holding hole, and which has lower end protruding from the probe block and coming into contact with the power semiconductor device on inspection, and one or more cooling units which cool the probe block. According to the probe assembly and the inspection apparatus, it is possible to inspect characteristics of power semiconductor devices accurately by suppressing temperature rises of the probes as well as the power semiconductor device under test.