Probe Assembly Pin Segregation for Signal Integrity

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Solution Overview

Problem

Existing test apparatuses for semiconductor devices face challenges in accurately transmitting both low voltage and high voltage signals due to the limited space on probe substrates and the degradation of signal accuracy caused by long cables, which affects the precision of low voltage and high frequency tests, as well as small current measurements.

Innovation Solution

A test apparatus with a probe assembly that separates low voltage and high voltage pins into distinct regions, allowing for efficient arrangement and transmission of signals, where high voltage pins are placed at a greater distance from low voltage pins, and the high voltage module is integrated into the test head to reduce cable interference, ensuring accurate testing without repeating low voltage tests.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If high voltage pins are increased in number, then high voltage testing capability is improved, but the space for low voltage pins is limited and sufficient probe pins cannot be ensured

Engineering Contradiction:
Improvehigh voltage testing capabilityVSAvoidspace for low voltage pins
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The probe substrate surface is divided into two distinct regions: a first region for low voltage pins and a second region for high voltage pins. This spatial segmentation allows both types of pins to be arranged systematically without interference, enabling the probe substrate to accommodate both low voltage and high voltage testing functions simultaneously.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Instead of arranging pins in a single-dimensional linear sequence, the invention utilizes two-dimensional spatial arrangement by creating separate regions on the probe substrate surface. This allows high voltage pins to be grouped in one area while low voltage pins occupy another area, effectively increasing the capacity for both pin types within the same substrate area.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Ease of operation

If test head and prober are connected by a long cable, then testing flexibility is improved, but signal accuracy is degraded due to resistance and capacitance components

Engineering Contradiction:
Improvetesting flexibilityVSAvoidsignal accuracy
Core Design Contradiction:
Ease of operationVSMeasurement precision

Solution Approach 1:

The high voltage module is extracted from the prober and integrated into the test head, allowing the high voltage signal generation to be separated from the signal transmission path. This enables the use of shorter cables for high voltage signals while maintaining testing flexibility, as the high voltage module can be positioned in the test head closer to the device under test.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The probe substrate serves as an intermediary component that directly transmits signals between the test head and device under test without requiring long cables. By integrating the high voltage module in the test head and using the probe substrate as the direct transmission medium, the system eliminates the need for long cables that would degrade signal accuracy.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Area of stationary object

If high voltage pins are arranged close to low voltage pins, then probe substrate space is utilized efficiently, but voltage interference occurs between the two types of pins

Engineering Contradiction:
Improveprobe substrate space utilizationVSAvoidvoltage interference
Core Design Contradiction:
Area of stationary objectVSObject-affected harmful factors

Solution Approach 1:

The probe substrate is segmented into distinct regions for low voltage and high voltage pins, with clear spatial separation between the two regions. This segmentation prevents voltage interference by ensuring that high voltage electric fields do not directly affect low voltage signal paths, while still utilizing the overall probe substrate area effectively through organized regional allocation.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS8829935B2Test apparatus
Publication Date: 2014.09.09 ADVANTEST CORP
  • US8829935B2 patent drawing
  • US8829935B2 patent drawing
  • US8829935B2 patent drawing

AI summary

A test apparatus that test a device under test, comprising a test head that is arranged facing the device under test and that includes a test module for testing the device under test, and a probe assembly that transmits a signal and that is arranged between the test head and the device under test. The probe assembly includes a plurality of low voltage pins arranged at prescribed intervals from each other, and a plurality of high voltage pins that are arranged such that distance between each high voltage pin and each low voltage pin is greater than the prescribed interval, and that transmit a signal with a higher voltage than a signal transmitted by the low voltage pins. All of the high voltage pins are arranged in only one of two regions formed by dividing a surface of the probe assembly in half.