Probe Assembly With Vertical Through-Hole Routing
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Solution Overview
Problem
Cantilever-type chip probe cards face challenges in maintenance and repair due to the inability to replace individual probes, resulting in high maintenance costs and poor transmission quality caused by long transmission paths and inductance issues.
Innovation Solution
A probe structure comprising a first base part, a second base part, a connecting part, and a contacting part, where the second base part includes a passive component electrically connected between its contacting and connecting segments, reducing inductance effects and allowing for individual probe replacement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If probes are fixed on the printed circuit board using epoxy resin, then the probe structure becomes stable and fixed, but the probe cannot be replaced individually and the whole set must be replaced when a probe is damaged
Solution Approach 1:
The probe structure is divided into separate replaceable modules. Each probe assembly (including probe, base part, and connecting segment) can be independently removed and replaced by inserting a new probe through the through-hole, while the base part remains fixed on the circuit board. This segmentation enables individual probe replacement without replacing the entire probe card.
2Strength
If artificially soldering is used to fix probes on the printed circuit board, then the probe can be securely attached, but the operation space required is larger and the transmission path becomes too long resulting in poor transmission quality
Solution Approach 1:
The probe connection structure transitions from a planar soldering approach to a three-dimensional configuration using through-holes that extend vertically through the circuit board. The probe passes through the through-hole and connects to the circuit board via contact segments, creating a shorter and more direct transmission path in the vertical dimension, thereby reducing transmission path length and improving signal quality.
3Strength
If the line diameter of the probe is relatively large, then the probe has sufficient mechanical strength, but the lines must be stacked in the vertical direction in addition to being arranged in the transverse direction, thus increasing the difficulty of the probe arrangement
Solution Approach 1:
The probe arrangement utilizes the vertical dimension by passing probes through through-holes in the circuit board. This allows probes to be arranged primarily in the transverse plane without requiring vertical stacking, as each probe occupies its own through-hole position. The base part and connecting segments provide structural support, enabling larger probe diameters for mechanical strength while maintaining simple two-dimensional arrangement.
4Volume of moving object
If the transmission path is long and narrow, then the probe structure is compact, but the inductance increases causing power resistance to increase along with frequency, reducing the voltage and resulting in poor testing yield
Solution Approach 1:
The transmission path is reconfigured to utilize the vertical dimension through the through-hole structure. The probe passes vertically through the circuit board, creating a shorter and wider transmission path compared to long narrow paths in the planar direction. This vertical routing reduces inductance and power resistance, improving voltage stability and testing yield while maintaining compact overall structure.
Solution Approach 2:
The transmission path geometry parameters are changed by transitioning from long and narrow to short and wide configuration through the vertical through-hole routing. This parameter change reduces the inductance and resistance of the transmission path, thereby improving power delivery and signal quality for high-frequency testing applications.
Data Source
AI summary
The present disclosure provides a probe assembly and a probe structure thereof. The probe structure includes a first base part, a second base part, a connecting part, and a contacting part. The first base part includes a first contacting segment and a first connecting segment. The first contacting segment includes a first abutting portion and a first side end portion connected to the first abutting portion. The second base part includes a second contacting segment, a second connecting segment, and a passive component disposed between the second contacting segment and the second connecting segment. The second contacting segment includes a second abutting portion and a second side end portion connected to the second abutting portion. The first connecting segment and the second connecting segment are connected to the connection part. The contacting portion is connected to the connection part.