Probe Base Plate Anchor Height Variation for Load Uniformity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing probe assemblies for semiconductor testing systems face challenges in maintaining uniform loads across probes, leading to variations in contact pressure and degraded test accuracy due to warping under high loads.
Innovation Solution
The proposed probe assembly includes a reinforcing plate, a wiring base plate, a probe base plate with varying anchor heights, an elastic connector, and brace/spacer portions to ensure uniform load distribution and prevent warping, allowing the probe base plate to be curved and fixed securely, ensuring consistent contact pressure across probes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a highly rigid reinforcing plate is used to prevent warping, then structural strength is improved, but the probe assembly still warps under enormous loads causing variations in load and distance to terminal
Solution Approach 1:
The patent applies local quality by varying the height of anchor portions across different locations on the probe base plate. The center anchor portions have different heights compared to peripheral anchor portions, creating localized structural differences that compensate for warping tendencies under load, thereby maintaining uniform probe contact characteristics.
Solution Approach 2:
The patent implements asymmetry by deliberately designing anchor portions with non-uniform heights. This asymmetric configuration counterbalances the symmetric warping forces that occur when the probe assembly is pressed against the DUT, ensuring that all probes maintain consistent contact characteristics despite the applied load.
2Stability of the object's composition
If a clamp head is fixed at the center portion to prevent raising, then center stability is improved, but manufacturing complexity and adjustment requirements increase
Solution Approach 1:
The patent changes the geometric parameter of anchor portion heights to achieve stability. By varying the height parameter of anchors at different locations, the design inherently compensates for warping without requiring additional mechanical components like clamp heads, thereby reducing device complexity while maintaining stability.
Solution Approach 2:
The patent applies preliminary action by pre-configuring the anchor portions with different heights during manufacturing. This preliminary structural configuration proactively compensates for expected warping under load, eliminating the need for post-assembly adjustments or additional stabilizing mechanisms.
3Ease of manufacture
If uniform anchor heights are used, then manufacturing simplicity is improved, but load uniformity across probes deteriorates under pressing force
Solution Approach 1:
The patent applies local quality by varying the height of anchor portions across different locations on the probe base plate. The center anchor portions have different heights compared to peripheral anchor portions, creating localized structural differences that compensate for warping tendencies under load, thereby maintaining uniform probe contact characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration ensures uniform loads across probes, improves test accuracy, simplifies manufacturing, and allows for easier adaptation to different probe densities without adjusting brace heights, providing a more versatile and cost-effective solution compared to traditional clamping methods.
Implementation Method 1
an elastic connector arranged between the wiring base plate and the probe base plate and electrically connecting the wiring base plate to the plurality of probes
Data Source
AI summary
A probe assembly includes a wiring base plate arranged on a lower surface side of a reinforcing plate and a probe base plate arranged on a lower surface side of the wiring base plate. The probe base plate includes a plurality of probes on a lower surface thereof and a plurality of anchor portions on an upper surface thereof, respectively. The anchor portions are set so that a height of the anchor portion arranged at a center portion of the probe base plate may be greater than a height of the anchor portion located at a peripheral portion of the probe base plate. Between the respective anchor portions and the reinforcing plate are arranged a plurality of brace portions corresponding to the plurality of anchor portions and determining a space between the probe base plate and the wiring base plate together with the anchor portions.