Probe Bending Fixture for Precise Angle Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional probe processing apparatuses struggle to produce bent probes with consistent and stable quality, especially for dimensions below 7 nanometers, due to difficulties in securely clamping the workpiece during deformation, leading to angular deviations and compromising the bending outcome, which is inadequate for advanced semiconductor processes.
Innovation Solution
A probe processing apparatus with a probe seat, pushing element, and stopping element, where the pushing element applies pressure horizontally to bend the probe towards the stopping element, ensuring precise alignment and stability during processing, using a design that allows for adjustable heights and orthogonal movements to achieve desired angles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional probe processing apparatuses are used to bend probes, then the bending process can be performed, but angular deviations occur and bending quality is inconsistent
Solution Approach 1:
The probe processing apparatus divides the clamping function into multiple independent clamping units with separate clamping points along the probe. This segmentation allows each clamping point to be independently adjusted and controlled, preventing angular deviations during bending while maintaining consistent bending quality across different probe positions
Solution Approach 2:
The clamping units are designed with multi-functionality to accommodate probes of different dimensions and specifications. The universal clamping mechanism can securely hold various probe types while maintaining precise angular control, making the apparatus suitable for advanced semiconductor processes requiring consistent bending quality across different probe sizes
2Device complexity
If linear probes are used with fixed inclination angle, then the structure is simple, but the probe tip slides on the electrode surface causing damage
Solution Approach 1:
The probe is transformed from a rigid linear structure with fixed inclination to a dynamically adjustable bent structure. The bending allows the probe to adapt its contact angle with the electrode surface, enabling elastic contact that reduces sliding distance and prevents electrode damage while maintaining structural integrity
Solution Approach 2:
The probe's geometric parameters are changed by bending it to a specific angle before use. This parameter modification allows the probe to achieve optimal contact characteristics with the electrode surface, reducing harmful sliding effects while maintaining structural simplicity in the overall design
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures consistent and stable bending of probes, meeting the stringent requirements of modern semiconductor manufacturing by minimizing angular deviations and enhancing the durability and reliability of probes.
Implementation Method 1
When the contact force becomes too great, the probe deflects slightly, creating an elastic contact with the micro-nano component. This elastic interaction helps reduce the sliding distance of the probe tip on the electrode surface
Data Source
AI summary
The present disclosure relates to a probe processing apparatus and a method for processing probes. The probe processing apparatus includes a probe seat, a pushing element, and a stopping element, wherein the pushing element and the stopping element are positioned at different heights. The probe seat includes an opening configured to secure a probe. The pushing element is disposed on a first bracket positioned on one side of the probe seat, while the stopping element is disposed on a second bracket positioned on the opposite side of the probe seat. During the processing procedure, one end of the pushing element contacts the probe and applies pressure, causing the probe to bend towards the stopping element.