Probe Block Design for Fine Pitch Semiconductor Testing
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Solution Overview
Problem
Manufacturing probe blocks for semiconductor chips with staggered pad arrangements is challenging due to the small pitch between pads, which requires high precision and results in weak structures and increased costs, especially when trying to maintain contact points without short-circuiting adjacent probes.
Innovation Solution
A probe block design featuring a thin flat panel structure with vertically arranged upper and lower holes and a center hole for beams, allowing probes to move vertically and preventing electrical connection between adjacent probes, thus maintaining contact without short-circuiting and enabling a uniform pitch between holes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If probes are arranged with fine pitch to match small pad pitch, then measurement precision is improved, but manufacturing precision becomes more difficult and structure becomes weaker
Solution Approach 1:
The probe block is segmented into multiple independent guide hole units, each capable of supporting probes at fine pitch. The guide holes are arranged in a grid pattern with uniform pitch, allowing the structure to be divided into modular sections that can be manufactured separately and assembled, reducing overall manufacturing difficulty while maintaining fine pitch capability
Solution Approach 2:
The invention transitions from a single-plane probe arrangement to a three-dimensional guide hole structure with uniform pitch in both X and Y directions. By adding the Y-dimension with uniform pitch arrangement, the system can accommodate fine pitch requirements without compromising manufacturing feasibility, as the uniform grid pattern simplifies the manufacturing process compared to irregular staggered patterns
2Measurement precision
If probes are arranged with fine pitch, then measurement precision is improved, but structural strength deteriorates
Solution Approach 1:
The guide block is segmented into multiple independent guide holes distributed in a uniform grid pattern. This segmentation allows each guide hole to support individual probes at fine pitch while the distributed arrangement throughout the block provides structural reinforcement, preventing the weakening that would occur with concentrated fine-pitch arrangements
Solution Approach 2:
By arranging guide holes with uniform pitch in both X and Y dimensions, the invention creates a three-dimensional distributed support structure. This multi-dimensional distribution of guide holes provides structural strength throughout the entire block volume, preventing localized weakness that would occur with single-plane fine-pitch arrangements
3Adaptability or versatility
If probes are arranged to contact staggered pads, then adaptability is improved, but manufacturing precision becomes more difficult due to non-uniform pitch
Solution Approach 1:
The invention creates a uniform pitch grid in both X and Y directions, transforming the probe support structure from a single-plane arrangement to a two-dimensional uniform lattice. This uniform grid can accommodate staggered pad patterns by allowing probes to contact pads at different X-Y coordinates while maintaining uniform manufacturing pitch, thus resolving the conflict between adaptability and manufacturing precision
Solution Approach 2:
The uniform pitch guide hole structure serves multiple functions: it supports both in-line and staggered pad arrangements, provides uniform manufacturing specifications, and maintains fine pitch capability. This universal structure can adapt to different pad configurations without requiring custom manufacturing processes for each pattern
Data Source
AI summary
There is provided a probe block comprising a probe including first contact portions, second contact portions, and beams connecting the first contact portion to the second contact portion and a guide where the probe is inserted and supported, wherein the probe block is installed in a probe card for inspecting a semiconductor chip.