Probe Block Guide Member for Fine Pitch Semiconductor Testing
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Solution Overview
Problem
The increasing complexity of semiconductor chip pads with fine pitches poses challenges in accurate alignment and contact during testing, as the number of probes increases, requiring more precise alignment and risk of damage to the pads.
Innovation Solution
A probe block with a guide member featuring upper, lower, and middle holes that allow probes to move vertically, supported by a bridge part with a bent portion for elastic movement, ensuring precise contact without direct bonding to the circuit substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the number of probes is increased to test more devices in parallel, then productivity is improved, but alignment precision becomes more critical and manufacturing complexity increases
Solution Approach 1:
The guide member acts as an intermediary between the probe card substrate and the probes. It provides pre-defined alignment features (upper holes, lower holes, and middle holes) that guide probe placement and ensure precise positioning without requiring complex alignment procedures during assembly. This mediator structure enables high probe counts while maintaining alignment precision.
2Reliability
If probes are directly bonded to the circuit substrate, then connection reliability is improved, but repairability and replaceability deteriorate
Solution Approach 1:
The probe assembly is segmented into three main components: the probe card substrate, the guide member, and the probes. The guide member serves as an intermediate component that connects the substrate to the probes. This segmentation allows probes to be replaced independently without damaging the substrate or permanent bonding structures, improving repairability while maintaining connection reliability through the structured interface provided by the guide member.
3Strength
If probes are made rigid for structural stability, then strength is improved, but ability to accommodate alignment variations and elastic movement deteriorates
Solution Approach 1:
The guide member is designed with localized flexibility through its hole structure. The upper holes, lower holes, and middle holes are strategically positioned and sized to allow controlled elastic movement of probes in specific directions while maintaining structural stability. This local quality approach enables probes to accommodate alignment variations and pad position variations without compromising overall structural integrity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables precise, elastic contact with semiconductor pads at fine pitches without bending or damaging the probes, facilitating accurate testing and easy repair, while maintaining a high probe density.
Implementation Method 1
a bridge part situated within the middle hole for interconnecting the first and second pin tips, wherein the upper, lower, and middle holes allow the probe to elastically moves in vertical direction
Data Source
AI summary
A probe block mounted on a probe card is provided for achieving fine pitch probes. A probe block for a probe card of a semiconductor test device according to the present invention includes a guide member and a probe. A guide member includes pairs of upper and lower holes and middle holes each interconnecting the upper and lower holes of each pair. A probe includes a first pin tip protruded through a corresponding upper hole for contacting a pad of a device to be tested and a second pin tip protruded through a corresponding lower hole for transferring an electrical signal to the device and a bridge part situated within the middle hole for interconnecting the first and second pin tips. The upper, lower, and middle holes allow the probe to elastically moves in vertical direction. The probe block of the present invention is advantageous in that the probes are supported by guide members so as not to be bent while maintaining a fine pitch. Also, the probe block of the present invention is advantageous in fabrication and repair since probes are elastically contacted rather than directly bonded to the circuit substrate of the probe card.