Probe Board Flatness Adjustment for Reliable Electrical Contact
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Solution Overview
Problem
The application of heat during bonding can cause the multilayer wiring board to warp, leading to inconsistent probe heights and poor electrical contact with electrode terminals in semiconductor integrated circuits.
Innovation Solution
An electrical connecting apparatus with a wiring board, probe board, reinforcing member, and cover member equipped with a flatness adjustment mechanism to correct warping and ensure consistent probe contact.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If bonding members are used to bond the multilayer wiring board and the wiring board, then the electrical connecting apparatus can be assembled, but the multilayer wiring board may warp due to heat application during bonding
Solution Approach 1:
The cover member is designed with a predetermined shape that applies preliminary counteracting force to prevent warping of the multilayer wiring board during the bonding process. The cover member's geometry is specifically configured to counteract the thermal deformation that occurs when bonding members are heated, thereby maintaining the flatness of the probe board area throughout the manufacturing process.
2Ease of manufacture
If the multilayer wiring board is bonded in an inclined state, then assembly can proceed, but the probe height varies and electrical contact with electrode terminals deteriorates
Solution Approach 1:
The cover member's predetermined shape is designed to apply counteracting force in advance to prevent inclined bonding of the multilayer wiring board. By maintaining the board in a flat, horizontal state during bonding, the probe heights remain consistent and proper electrical contact with electrode terminals is ensured.
Solution Approach 2:
The cover member modifies the physical state of the multilayer wiring board by applying mechanical force through its predetermined shape, changing the board's orientation from potentially inclined to flat. This parameter change (from inclined to horizontal) ensures uniform probe height and reliable electrical contact.
3Device complexity
If no flatness adjustment mechanism is provided, then the device structure remains simple, but the flatness of the probe board cannot be maintained
Solution Approach 1:
The flatness adjustment function is merged into the cover member itself through its predetermined shape design. Rather than adding a separate adjustment mechanism, the cover member's geometry inherently provides the flatness adjustment function, maintaining structural simplicity while achieving the required precision.
Solution Approach 2:
The cover member serves dual purposes: it protects the bonding members and simultaneously adjusts the flatness of the multilayer wiring board through its predetermined shape. The cover member self-adjusts the board flatness without requiring external adjustment mechanisms, making the system self-sufficient.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus improves the flatness of the multilayer wiring board, ensuring accurate electrical contact with electrode terminals and enhancing the reliability of electrical testing.
Implementation Method 1
the application of heat may cause the multilayer wiring board 12 to warp
Data Source
AI summary
The flatness of a board on which a plurality of probes are mounted is adjusted to improve the electrical contact of the probes with the electrode terminals of a test subject. The electrical connecting apparatus of the present disclosure includes: a wiring board electrically connected to a testing device; a probe board provided on a bottom surface side of the wiring board and having one or more probe attachment parts on which a plurality of probes are mounted for each electrode terminal of a test subject that has one or more electrode terminals, the plurality of probes being electrically contacted with the corresponding electrode terminals; and a cover member that adjusts flatness of the probe board and has at least one or more flatness adjustment mechanisms provided corresponding to each of the probe attachment parts of the probe board.