Probe Board Thermal Isolation for Semiconductor Testing
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Solution Overview
Problem
The existing electric connecting apparatuses for testing integrated circuits face challenges in quickly establishing stable contact due to thermal expansion differences between semiconductor wafers and probe boards, leading to prolonged setup times for temperature stabilization and measurement initiation.
Innovation Solution
The apparatus incorporates a heat conduction decreasing mechanism using a heat insulating member between the circuit board and probe board, along with elastic heat conducting members and a pogo pin connector, to minimize heat transfer and facilitate faster thermal equilibrium, allowing for earlier probe contact and measurement start.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If the probe board is heated by radiation heat from the stage and integrated circuits to reach thermal equilibrium, then the temperature stability is improved, but the time required for measurement start is increased
Solution Approach 1:
A heat insulating member (intermediary element) is introduced between the circuit board and probe board to control heat transfer. This mediator allows the probe board to be thermally isolated from the heated stage, enabling faster thermal equilibrium while maintaining stable contact between probes and electrodes during measurement
Solution Approach 2:
The supporting structure is divided into separate components: a circuit board for electrical connection and a probe board for probe mounting, connected through a heat insulating member. This segmentation allows independent thermal management of each component, reducing overall thermal equilibrium time
2Temperature
If the integrated circuits and probe board are heated to predetermined temperature, then the measurement conditions are improved, but the relative positional relationship between electrodes and contact tip ends deteriorates due to differential thermal expansion
Solution Approach 1:
The heat insulating member acts as a thermal barrier that prevents excessive heat transfer to the probe board, reducing differential thermal expansion between the semiconductor wafer and probe board while still allowing the system to operate at elevated temperatures for measurement
Solution Approach 2:
The thermal parameters of the system are modified by introducing the heat insulating member with specific thermal conductivity properties, changing the heat flow characteristics to minimize positional drift while maintaining measurement temperature requirements
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration significantly reduces the time required for the probe board to reach thermal equilibrium and initiate measurements, shortening the overall setup time without complicating the apparatus configuration or control method.
Implementation Method 1
an electric connector electrically connecting the first conductive path to the second conductive path, wherein the electric connector has a heat conduction decreasing means provided between the circuit board and the probe board to decrease heat conduction between the circuit board and the probe board
Implementation Method 2
the heat conduction decreasing means has a heat insulating member having lower heat conductivity than that of the supporting body
Data Source
AI summary
An apparatus includes a wiring base plate arranged on an upper side of a chuck top and having a wiring path connected to a tester, a probe card having a probe board spaced from the wiring base plate with a first surface thereof opposed to the wiring base plate and having a wiring path corresponding to the wiring path and probes provided on a second surface of the probe board to be connected to the wiring path and enabling to respectively contact connection pads of a semiconductor wafer on the chuck top, and an electric connector connecting the wiring base plate to the probe board by low heat conduction supporting members and decreasing heat conduction therebetween and electrically connecting the wiring paths.