Wafer Probe Device Camera Alignment via Target Mark
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Solution Overview
Problem
Existing probe devices face challenges in adjusting physical parameters and maintaining consistency across different devices due to inter-device differences, affecting the accuracy of wafer inspection and alignment.
Innovation Solution
The probe device incorporates an upper and lower camera, a target member with a target mark, and a control circuit that captures images of the target mark to calculate correspondence between physical parameters, adjusts lighting output, and moves the stage to determine pixel dimensions and positions, enabling adjustments regardless of inter-device differences.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple cameras and target members are added to enable physical parameter adjustment, then measurement precision is improved, but device complexity increases
Solution Approach 1:
A target member with a target mark is introduced as an intermediary object between the cameras and the physical parameters being measured. The target mark serves as a reference that enables the control circuit to calculate correspondences between physical parameters and image values without requiring direct complex measurements of each parameter individually.
Solution Approach 2:
The target member provides a standardized target mark that can be captured by multiple cameras. This creates a common reference copy that can be used across different devices and camera systems, enabling consistent physical parameter measurements without requiring each device to have identical inherent characteristics.
2Reliability
If device configuration is standardized to reduce inter-device differences, then reliability is improved, but adaptability worsens
Solution Approach 1:
The system dynamically adjusts physical parameters based on captured images of the target mark. The control circuit calculates correspondences between physical parameters and image values, allowing the system to adapt to different device configurations while maintaining measurement reliability through real-time parameter adjustment rather than fixed standardization.
Solution Approach 2:
Physical parameters are adjusted based on the calculated correspondences from target mark images. This allows the system to change parameters dynamically to compensate for inter-device differences, maintaining reliability across different devices while preserving adaptability to various measurement requirements.
Data Source
AI summary
There is provided a probe device for inspecting a wafer. The probe device includes: an upper camera provided in a wafer alignment unit; a lower camera provided in a stage; a target member provided in any one of the wafer alignment unit and the stage; and a control circuit configured to control each operation of the upper and lower camera. The target member has an end surface on which a target mark is provided, wherein any of the upper and lower camera is configured to capture an image of the target mark. The control circuit is configured to acquire a captured image of the target mark using any of the upper camera and the lower camera; and calculate a correspondence between a specific physical parameter and a value represented in the captured image for a parameter represented in the captured image among physical parameters, based on the acquired captured image.