Probe Card Alignment Chip for Replaceable Symbol Repair
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Solution Overview
Problem
Existing probe cards face issues with alignment symbol defects leading to decreased yield and increased manufacturing complexity due to the need for complex and costly repair methods, which often result in discarding the entire wiring board.
Innovation Solution
An alignment chip with a substrate and a metal film alignment symbol is used to easily form and repair alignment symbols on the wiring board, featuring a symbol peripheral region with lower reflectance and optional resin film for enhanced strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If alignment symbols are formed by photolithography processing on the wiring board, then the alignment symbols can be precisely formed, but the entire wiring board must be manufactured again if defects occur, decreasing yield
Solution Approach 1:
The alignment symbol is segmented from the wiring board by forming it as a separate metal film layer that can be independently replaced. The alignment symbol layer is separated from the substrate layer, allowing defective alignment symbols to be removed and replaced without discarding the entire wiring board, thus resolving the contradiction between precision formation and yield loss.
Solution Approach 2:
The invention enables recovery of the wiring board by allowing replacement of only the defective alignment symbol portion rather than discarding the entire board. The metal film alignment symbol can be selectively removed and replaced, recovering the value of the otherwise wasted wiring board substrate and probe electrode pads.
2Ease of repair
If complex repair methods are used for alignment symbol defects, then defect repair is attempted, but manufacturing complexity and costs increase
Solution Approach 1:
The alignment symbol is segmented as a separate replaceable component, enabling simple repair by removal and replacement of only the defective alignment symbol layer without complex repair processes. This segmentation allows straightforward repair that reduces both complexity and cost.
Solution Approach 2:
The alignment symbol is designed as a disposable or easily replaceable component with lower value compared to the wiring board substrate. When defects occur, the cheap alignment symbol layer is replaced rather than attempting complex repairs, simplifying the repair process and reducing costs.
3Reliability
If the entire wiring board is discarded due to alignment symbol defects, then defect-free alignment symbols are ensured, but yield decreases
Solution Approach 1:
The alignment symbol is segmented from the wiring board as an independent replaceable layer, enabling replacement of only defective alignment symbols while preserving the wiring board substrate. This segmentation maintains alignment symbol quality while preventing unnecessary discarding of functional wiring boards, thus improving yield.
Solution Approach 2:
The invention enables recovery of wiring boards that would otherwise be discarded due to alignment symbol defects. By replacing only the defective alignment symbol portion and recovering the valuable wiring board substrate, the system maintains reliability while significantly improving overall yield.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Facilitates easy formation and repair of alignment symbols, reducing manufacturing complexity and costs while maintaining production efficiency and yield.
Implementation Method 1
The alignment symbol 30 is made of a metal material having a high reflectance
Implementation Method 2
a substrate having a pasting surface to be pasted to a probe installation surface of a wiring board constituting a probe card via an adhesive
Data Source
AI summary
An object is to provide an alignment chip for forming an alignment symbol on a wiring board of a probe card. Provided are: a substrate 51 having a pasting surface to be pasted to a probe installation surface 17 of a wiring board 14 constituting a probe card 10 via an adhesive 54; and an alignment symbol 501 made of a metal film 52 formed on a symbol surface on a side opposite to the pasting surface of the substrate 51. The symbol surface includes a symbol peripheral region 502 surrounding the alignment symbol 501, and the symbol peripheral region 502 has a lower reflectance than the alignment symbol 501.