Semiconductor Probe Card Alignment via Mark Recognition
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Solution Overview
Problem
The existing methods for positioning a probe card during semiconductor device testing face challenges due to the difficulty in accurately recognizing the positions of probe tips, especially with the reduction in chip size and increase in terminal count, leading to inaccurate orientation recognition and positioning operations.
Innovation Solution
A test apparatus that includes a probe card recognition unit to recognize probe card marks, a backing material recognition unit to recognize backing material marks, and a positional relationship recognition unit to correct the position of the probe card and backing material based on the connection lines formed by these marks, allowing for accurate alignment without relying on tip position recognition.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the tip position of the probe is used for orientation recognition, then the positioning can be performed, but the measurement precision deteriorates due to the bent tip shape and shallow depth of field making tip position difficult to recognize accurately
Solution Approach 1:
The invention uses mark positions on the probe card as a copy or substitute for the actual probe tip positions. Instead of directly recognizing the bent probe tip position which is difficult to detect, the system recognizes the position of marks that are easily detectable and use this information to determine probe card orientation and positioning, thereby solving the measurement precision problem while maintaining ease of operation
Solution Approach 2:
The mark positions serve as an intermediary between the imaging apparatus and the probe tips. Rather than directly imaging and measuring the bent probe tips, the system images the marks, determines orientation based on mark positions, and uses this intermediate information to achieve accurate positioning, thus resolving the contradiction between ease of operation and measurement precision
2Manufacturing precision
If manual positioning method is used with display feedback, then the positioning can be performed, but the productivity deteriorates due to the time-consuming manual operation
Solution Approach 1:
The system performs automatic positioning by having the imaging apparatus capture images, the control unit automatically calculate orientations based on mark positions, and the system self-correct positioning without requiring manual intervention. This self-service approach maintains high positioning accuracy while dramatically improving productivity by eliminating time-consuming manual operations
Solution Approach 2:
The invention replaces the manual mechanical positioning system with an automated optical-mechanical system. Instead of manual manipulation with visual feedback, the system uses imaging apparatus to capture mark positions, control units to calculate orientations, and automated mechanisms to adjust positioning, thereby maintaining precision while improving productivity through automation
Data Source
AI summary
A test apparatus according to the present invention includes a probe card recognition unit that recognizes positions of at least two probe card marks formed to a probe card and assumes a probe card mark connection line connecting the positions of the probe card marks, a backing material recognition unit that recognizes positions of at least two backing material marks formed to a backing material where a semiconductor chip is fixed thereto and assumes a backing material mark connection line connecting the positions of the backing material mark, a positional relationship recognition unit that recognizes a positional relationship between the probe card and the backing material according to the probe card mark connection line and the backing material mark connection line, and a correction unit that corrects the position of at least one of the probe card and the backing material according to the positional relationship.