Probe Card Alignment Symbol Repair via High Reflection Chip
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Solution Overview
Problem
Conventional probe cards require remanufacture of the entire wiring substrate when defects occur in the alignment symbols, leading to reduced yield due to the inability to repair defects in the alignment symbols.
Innovation Solution
A probe card configuration that includes a high reflection chip with a through-hole and a low reflection sheet, allowing for the attachment and repair of alignment symbols on the wiring substrate without the need for photolithography processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If photolithography processing is used to form alignment symbols on the wiring substrate, then the alignment symbols can be formed with precise patterns, but the entire wiring substrate must be remanufactured when defects occur in the alignment symbols, reducing yield
Solution Approach 1:
The alignment symbol is segmented into a removable sheet-like member that can be detached and replaced independently from the wiring substrate. This allows repair of defective alignment symbols without remanufacturing the entire substrate, resolving the contradiction between precise formation and yield loss.
Solution Approach 2:
The sheet-like member containing the alignment symbol is designed to be replaceable. When defects occur, the defective sheet is discarded and replaced with a new one, while the valuable wiring substrate is recovered and reused. This eliminates the need to discard the entire substrate due to alignment symbol defects.
2Device complexity
If the alignment symbol is formed as an integral part of the wiring substrate, then the structure is simple and robust, but defects in the alignment symbol require complete remanufacturing of the substrate
Solution Approach 1:
The alignment symbol structure is segmented into a separate sheet-like member that can be independently removed and replaced. This segmentation enables easy repair by simply detaching and replacing the sheet, without complicating the overall device structure.
Solution Approach 2:
The alignment symbol is extracted from the wiring substrate and placed on a separate sheet-like member. This extraction allows the alignment symbol to be repaired by removing and replacing just the sheet, while the wiring substrate remains intact and reusable.
3Reliability
If the entire wiring substrate is remanufactured when alignment symbol defects are detected, then quality control is maintained, but the yield and cost efficiency are significantly reduced
Solution Approach 1:
When alignment symbol defects are detected, only the defective sheet-like member is discarded and replaced, while the wiring substrate is recovered and reused. This maintains quality control by ensuring proper alignment symbols are used, while dramatically improving yield by preserving the valuable substrate.
Solution Approach 2:
The repair approach applies local quality control by replacing only the defective alignment symbol portion (sheet-like member) rather than the entire substrate. This maintains the required quality standards for alignment while avoiding unnecessary remanufacturing of the complete substrate.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables the formation and repair of alignment symbols on the wiring substrate, improving the yield of probe cards by allowing for defect repair without discarding the entire substrate.
Implementation Method 1
a mirror-finished high reflection surface which is an other surface, and has a ridge in which the adhesive formed on the affixing surface extends into the through-hole
Data Source
AI summary
The purpose of the present invention is to provide a method for repairing a probe card in which a defect has occurred in an alignment symbol or a peripheral region thereof by using a high reflection chip for alignment. The present invention is provided with a probe 16 for contacting an inspection object, a wiring substrate 14 to which the probe 16 is attached, and a high reflection chip 4 for alignment provided to a probe installation surface 17 of the wiring substrate 14. The high reflection chip 4 includes a metal plate having a fixing through-hole 41, and has an affixing surface to be attached to the probe installation surface 17 with an adhesive 6 and a mirror-finished high reflection surface on the other side from the affixing surface. The adhesive 6 formed on the affixing surface has a ridge 61 that extends into the fixing through-hole 41.