Probe Card Module Arc Reinforcement Deformation Control

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Solution Overview

Problem

Probe cards used in wafer manufacturing face deformation and reduced lifespan due to high reaction forces from numerous probes contacting chip bonding pads, affecting inspection quality and probe longevity.

Innovation Solution

A probe card module with an arc-shaped reinforcement assembly on its second surface, featuring support bases and arc-shaped bodies that lean against the central zone to distribute and absorb stress, enhancing structural strength and reducing deformation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the number of probes is increased to inspect more bonding pads, then the inspection capability is improved, but the reaction force increases causing probe card deformation

Engineering Contradiction:
Improveinspection capabilityVSAvoidstructural strength
Core Design Contradiction:
ProductivityVSStrength

Solution Approach 1:

The patent employs an arc-shaped reinforcement assembly with curved geometry that spans across the probe card assembly. This curved structure efficiently distributes the concentrated reaction forces from multiple probes across a broader area, preventing localized stress concentration and deformation while maintaining the ability to support a high number of probes for comprehensive bonding pad inspection

Inventive Principle:
Principle #14Spheroidality (Curvature)

2Quantity of substance

If the number of probes is increased to reach 10,000 to 20,000, then the coverage of bonding pads is improved, but the deformation of probe card increases

Engineering Contradiction:
Improvenumber of probesVSAvoiddeformation
Core Design Contradiction:
Quantity of substanceVSShape

Solution Approach 1:

The reinforcement structure is divided into multiple discrete arc-shaped reinforcement assemblies distributed across the probe card assembly. Each arc-shaped component independently supports a local region with high probe density, collectively providing comprehensive support across the entire assembly and preventing deformation even with 10,000 to 20,000 probes contacting bonding pads

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS11156639B2Probe card module
Publication Date: 2021.10.26 GLOBAL UNICHIP CORPORATION
  • US11156639B2 patent drawing
  • US11156639B2 patent drawing
  • US11156639B2 patent drawing

AI summary

A probe card module including a probe card assembly and a strengthening structure is provided. The probe card assembly includes a first surface, a second surface opposite to the first surface, and a plurality of probes protruding from the first surface. The second surface includes a central zone and a peripheral zone surrounding the central zone. Projections of the probes on the second surface are located at the central zone. The strengthening structure is disposed on the second surface and includes two support bases which protrude from the peripheral zone and are away from each other, and the strengthening structure also includes an arc-shaped reinforcement assembly connected to the two support bases, where the arc-shaped reinforcement assembly protrudes toward and leans against the central zone.