Probe Card Cleaning via Depressurization and Gas Flow
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Solution Overview
Problem
In inspection apparatuses, foreign substances on the stage and probes can hinder temperature adjustment and cause warping of wafers, necessitating regular cleaning to maintain inspection quality and accuracy.
Innovation Solution
A cleaning method that involves transferring the stage to face a probe card, depressurizing the space between the stage and probe card, introducing a gas to peel off foreign substances, and continuously exhausting to discharge them, effectively cleaning both the stage and probes without manual intervention or stopping the apparatus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If foreign substances are present on the stage and probes, then inspection quality deteriorates due to hindered temperature adjustment and wafer warping, but manual cleaning requires stopping the apparatus and consumes time
Solution Approach 1:
The cleaning process is performed automatically during the inspection cycle without requiring separate manual intervention. The stage is automatically transferred to the probe card position, depressurized, and cleaned of foreign substances, eliminating the need to stop the apparatus for manual cleaning.
Solution Approach 2:
The system performs self-cleaning by automatically transferring the stage to face the probe card, depressurizing the space between them, and removing foreign substances through the pressure differential and gas introduction, without requiring external manual operation.
2Manufacturing precision
If manual cleaning is performed to remove foreign substances, then inspection quality is maintained, but operational efficiency decreases due to apparatus stopping and manual effort
Solution Approach 1:
Manual mechanical cleaning operations are replaced by an automated pneumatic system. The stage is automatically positioned and cleaned using pressure differential and gas flow through the space between the stage and probe card, eliminating manual intervention and maintaining continuous operation.
Solution Approach 2:
The cleaning mechanism utilizes pneumatic principles by introducing gas into the depressurized space between the stage and probe card, using pressure differentials to remove foreign substances automatically, replacing manual mechanical cleaning methods.
3Reliability
If traditional cleaning methods are used, then foreign substances are removed, but probe wear increases due to contact-based cleaning
Solution Approach 1:
Contact-based mechanical cleaning is replaced by a non-contact pneumatic cleaning system. Gas flow through the depressurized space removes foreign substances without physical contact with the probes, eliminating wear while maintaining cleaning effectiveness.
Solution Approach 2:
Gas serves as an intermediary medium to remove foreign substances from the probes and stage surface without direct contact. The gas flow carries away contaminants through the depressurized space, preventing mechanical wear on the probes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method reliably removes foreign substances from both the stage and probes, ensuring accurate temperature adjustment and maintaining high inspection quality without wearing down the probes or requiring manual effort, thus enhancing operational efficiency.
Implementation Method 1
exhausting and depressurizing a space between the probe card and the stage facing the probe card
Implementation Method 2
introducing a gas into the space which has been depressurized
Data Source
AI summary
A cleaning method in an inspection apparatus that performs an electrical characteristic inspection on a device under test formed in an inspection object, includes: transferring, in a transfer process, a stage on which the inspection object is mounted to a position facing a probe card having probes, the probes being brought into contact with the device under test during the electrical characteristic inspection; subsequently, exhausting and depressurizing a space between the probe card and the stage facing the probe card in a peeling-off preparation process; introducing a gas into the space which has been depressurized and peeling off foreign substances adhering to a front surface of the stage and the probes in a foreign substance peeling-off process; and exhausting the space to discharge the foreign substances while continuously introducing the gas into the space in a foreign substance discharging process.


