Probe Card Contact Device for Uniform Electrical Resistance
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Solution Overview
Problem
Conventional substrate inspection apparatuses experience non-uniform electrical contact resistances between semiconductor device electrodes and probe card probes, leading to inadequate electrical characteristic inspections.
Innovation Solution
A device that transfers a substrate with a plate-shaped member to a probe card, moving it by a preset amount to ensure firm contact, then depressurizes the space between the probe card and the plate-shaped member to maintain contact and reduce resistance, using a holding device to apply sufficient pressure and a separating device to secure the contact state.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is transferred to a position facing the probe card and moved toward the probe card to bring electrodes into contact with probes, then electrical characteristic inspection can be performed, but electrical contact resistances at respective contact portions become non-uniform
Solution Approach 1:
The substrate is over-driven by a preset amount beyond the initial contact position, and the space between the probe card and plate-shaped member is then depressurized to maintain optimal contact. This preliminary over-drive action ensures uniform electrical contact resistance across all contact portions before the inspection begins.
Solution Approach 2:
The pressure in the space between the probe card and plate-shaped member is changed from atmospheric pressure to a depressed state. This parameter change (pressure reduction) maintains firm and uniform contact between the electrodes and probes, ensuring consistent electrical contact resistance across all measurement points.
2Force
If the lifting device is extended to move the substrate upward to contact electrodes with probes, then contact is established, but contact force uniformity deteriorates
Solution Approach 1:
A holding device uses pneumatic pressure control to depressurize the space between the probe card and plate-shaped member. This pneumatic mechanism applies uniform contact force across all probe-electrode contact points, ensuring consistent contact pressure and uniform electrical contact resistance throughout the inspection process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures uniform electrical contact resistance, allowing for accurate and reliable electrical characteristic inspections of semiconductor devices by maintaining contact and reducing non-uniformity.
Implementation Method 1
a holding device configured to hold a contact state between the multiple electrodes of the semiconductor devices and the multiple probes of the probe card by depressurizing a space between the probe card and the plate-shaped member
Data Source
AI summary
A device of contacting a substrate with a probe card includes a mounting table 15 that transfers a wafer W together with a wafer plate 24 to a position facing the probe card 19; a lifting device 15a that contacts multiple electrodes of semiconductor devices formed on the wafer W with multiple probes of the probe card 19 by moving the wafer plate 24 and the wafer W toward the probe card 19 and then further moves the wafer W toward the probe card 19; a depressurization path 26 that decompresses a space S between the probe card 19 and the wafer plate 24 and maintains a contact state between the electrodes of the semiconductor devices and probes 19b of the probe card 19; and the lifting device 15a that separates a chuck member 14 on the mounting table 15 from the wafer plate 24.