Probe Card Contact Uniformity via Decompression
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Solution Overview
Problem
Conventional wafer inspection methods experience non-uniform electrical contact resistance between probe cards and semiconductor device electrodes, leading to ineffective inspection of electrical characteristics.
Innovation Solution
A method involving a transferring process to position a substrate with a chuck member and a plate-shaped member, followed by a contacting process where the substrate is moved closer to the probe card, and then a holding process where the space between the probe card and the plate-shaped member is decompressed to maintain contact, allowing the electrodes to align with the probes without resistance non-uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the substrate is lifted upward by an elevating device to contact electrodes with probes, then electrical contact is achieved, but electrical contact resistance becomes non-uniform
Solution Approach 1:
The substrate is preliminarily positioned on the chuck member with the plate-shaped member therebetween before the contacting process. This preliminary positioning ensures that when the substrate is moved toward the probe card, the contact surface is pre-aligned with the leading ends of the probes, preventing non-uniform contact resistance from the outset.
Solution Approach 2:
A plate-shaped member is introduced as an intermediary between the chuck member and the substrate. This plate-shaped member serves as a mediator that helps align the substrate's contact surface with the probe card's leading ends during the contacting process, ensuring uniform electrical contact resistance across all contact points.
2Manufacturing precision
If the substrate contact surface aligns with the probe card leading ends, then uniform electrical contact resistance is achieved, but additional positioning mechanisms are required
Solution Approach 1:
The plate-shaped member acts as an intermediary component that simplifies the alignment process. By positioning the substrate on this plate-shaped member rather than directly on the chuck member, the system achieves precise contact surface alignment without requiring complex additional positioning mechanisms.
Solution Approach 2:
The positioning function is segmented into two independent components: the chuck member for holding the plate-shaped member, and the plate-shaped member for holding and aligning the substrate. This segmentation allows each component to be optimized for its specific function, achieving precise alignment without increasing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method ensures uniform electrical contact resistance, enabling effective inspection of semiconductor devices by allowing the substrate's contact surface to align with the probe card's leading ends, thereby improving inspection accuracy.
Implementation Method 1
a holding process of maintaining a contact state between the electrodes of the semiconductor devices and the probes of the probe card by decompressing a space between the probe card and the plate-shaped member after the contacting process
Data Source
AI summary
A method of contacting a substrate with a probe card in a substrate inspection apparatus can inspect electrical characteristics of semiconductor devices on the substrate. A wafer W is transferred to a position facing a probe card 36 while being mounted on a chuck member 22 with a wafer plate 37 therebetween, and electrodes of semiconductor devices on the wafer W are contacted with probes of the probe card 36 by moving the wafer W and the wafer plate 37 toward the probe card 36 through an elevating device 43. Then, the wafer W is overdriven toward the probe card 36 and a contact state between the electrodes of the semiconductor devices and the probes of the probe card 36 is maintained by decompressing a space S between the probe card 36 and the wafer plate 37. Then, the chuck member 22 is separated from the wafer plate 37.