Probe Card Impedance Reduction via Layered Die and Extending Arm
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Solution Overview
Problem
Conventional probe card devices with long and thin probes experience increased inductance values, leading to power impedance issues, making them unsuitable for accurately testing high-speed transmission functions of devices under test (DUTs).
Innovation Solution
A probe card device design featuring an upper die unit, impedance adjusting member, lower die unit, spacer, and conductive probes with matching probes that include an extending arm, allowing electrical coupling to the impedance adjusting member through a circuit layer, thereby reducing signal transmission path impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional long and thin probes are used in probe card devices, then the device structure is simple and easy to manufacture, but the inductance value increases leading to power impedance issues that prevent accurate high-speed transmission testing
Solution Approach 1:
The probe card device is divided into multiple functional layers including upper die unit, lower die unit, and intermediate structures. The signal transmission path is segmented into multiple conductive connections rather than using a single long probe, thereby reducing inductance while maintaining structural manageability
Solution Approach 2:
The invention transitions from a single-dimensional long probe structure to a multi-dimensional layered architecture where signal transmission occurs through horizontal and vertical conductive paths in different layers, effectively shortening the electrical path length and reducing inductance
2Loss of energy
If the impedance adjusting member is positioned far from the DUT, then the device structure is simpler, but the power impedance increases reducing signal transmission efficiency
Solution Approach 1:
The impedance adjusting member is pre-positioned in optimal proximity to the DUT contact area, and the circuit layer is pre-configured with appropriate impedance values. This preliminary arrangement ensures minimal impedance mismatch and maximum signal transmission efficiency from the outset
Solution Approach 2:
The circuit layer serves as an intermediary between the DUT and the impedance adjusting member, providing direct electrical coupling and impedance control. This intermediary structure enables precise impedance management without requiring complex external adjustment mechanisms
Data Source
AI summary
A probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, an impedance adjusting member, and conductive probes. The upper die unit includes a first die and a second die spaced apart from the first die. The first die has a penetrating hole, and the second die has a circuit layer. The impedance adjusting member is disposed on the second die and is electrically coupled to the circuit layer. Each of the conductive probes passes through the upper die unit, the spacer, and the lower die unit. At least one of the conductive probes includes an upper contacting segment protruding from the upper die unit and an extending arm connected to the upper contacting segment. The extending arm is abutted against the circuit layer by passing through the penetrating hole.