Probe Card Wiring Board Flatness Adjustment for Reliable Wafer Testing
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Solution Overview
Problem
Conventional probe card assemblies face issues with contact failures due to deformation in the printed wiring board and limited space for connectors, affecting semiconductor wafer testing.
Innovation Solution
A semiconductor wafer testing apparatus with adjustable wiring boards and mechanisms that adjust flatness by changing the position of second wiring boards relative to first wiring boards, using connectors and adjusting screws to maintain electrical connections while correcting deflections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a dedicated flattening device is added to the probe card assembly, then the flatness adjustment capability is improved, but the space for mounting connectors on the wiring board is reduced
Solution Approach 1:
The invention divides the flattening function into separate adjusting mechanisms (screws) that are distributed at multiple positions on the wiring board rather than using a single dedicated flattening device. This segmentation allows the flattening function to be integrated with the connector mounting areas, preventing contact failures between the printed wiring board and interposer while maintaining adequate space for connector installation.
2Manufacturing precision
If the probe card assembly includes a dedicated flattening device, then flatness control is improved, but device complexity increases
Solution Approach 1:
The invention merges the flattening adjustment function with the existing connector mounting structure by integrating adjusting mechanisms into the wiring board assembly. This combines multiple functions (flattening and connector mounting) into a unified structure, reducing overall device complexity while maintaining flatness control capability.
Solution Approach 2:
The adjusting mechanisms serve multiple purposes: they provide flatness adjustment capability while also being part of the overall wiring board assembly structure that supports connectors. This multi-functionality reduces the need for separate dedicated components, thereby reducing device complexity.
3Reliability
If connectors are mounted on the wiring board, then electrical connection is enabled, but the flatness of the wiring board deteriorates due to deformation
Solution Approach 1:
The invention implements adjusting mechanisms that allow preliminary flatness adjustment of the wiring board before final connector installation and assembly. This preliminary action ensures the wiring board is properly flattened to prevent contact failures, and the adjusting mechanisms remain in place to maintain this flatness throughout operation.
Data Source
AI summary
A semiconductor wafer testing apparatus tests a device under test (DUT) on a semiconductor wafer. The semiconductor wafer testing apparatus includes a first wiring board including first connectors and that is electrically connected to a probe card having probes that contact the DUT, second wiring boards each including a second connector configured to be fitted to a respective one of the first connectors, and adjusting mechanisms that adjust a flatness of the first wiring board by changing a position of the second wiring boards along a normal direction of the first wiring board when the first connectors are fitted to the second connectors.