Probe Card Flexible Board Impedance Control via Segmented Die
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Solution Overview
Problem
Conventional probe card devices are unsuitable for accurately testing high-speed transmission functions due to their long and thin shape, which increases inductance values and results in power impedance issues.
Innovation Solution
A probe card device with an upper die unit, impedance adjusting member, lower die unit, spacer, and conductive probes, where the flexible board is electrically coupled to the impedance adjusting member through a circuit layer, allowing for reduced power impedance by separating a part of the flexible board from the second die, thereby minimizing friction and maintaining stable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If conventional long and thin probes are used, then the probe card device can be manufactured with simple structure, but the inductance value increases and power impedance issues occur
Solution Approach 1:
The probe card device is divided into multiple layers including upper die unit, lower die unit, flexible board, and spacer. The conductive probes are segmented into upper contacting segment and lower contacting segment, with impedance adjusting members positioned at specific locations to control impedance characteristics without requiring long continuous probe structures.
Solution Approach 2:
The impedance adjusting member acts as an intermediary element between the conductive probes and the signal transmission path. This component specifically controls the impedance characteristics to reduce power impedance issues while maintaining the functional integrity of the probe card device.
2Stability of the object's composition
If the flexible board is fixed to the second die, then structural stability is improved, but friction increases and electrical connection stability deteriorates
Solution Approach 1:
The flexible board is designed to be separable from the second die through the action of conductive probes receiving internal forces. This dynamic configuration allows the flexible board to move relative to the second die, reducing friction while maintaining structural stability when needed.
Solution Approach 2:
The conductive probes are configured to automatically separate the flexible board from the second die when internal forces are applied. This self-service mechanism reduces friction without requiring external intervention, maintaining electrical connection stability while enabling necessary movement.
3Area of stationary object
If long probe structures are used, then the probe card can cover larger testing area, but the inductance value increases reducing testing accuracy for high-speed functions
Solution Approach 1:
The probe card device utilizes a multi-layer vertical structure with upper die unit, lower die unit, and flexible board arranged in different spatial dimensions. This dimensional change allows the testing area to be expanded vertically rather than requiring excessively long horizontal probe structures, thereby reducing inductance while maintaining large testing capacity.
Data Source
AI summary
A probe carrier of a probe card device includes an upper die unit, a lower die unit, a spacer sandwiched between the upper and lower die units, and an impedance adjusting member. The upper die unit includes a first die, a second die spaced apart from the first die, and a flexible board disposed on the second die and arranged away from the first die. The flexible board includes a plurality of penetrating holes and a circuit layer. The impedance adjusting member is disposed on the flexible board and is electrically coupled to the circuit layer. The circuit layer includes at least one plated wall arranged in at least one of the penetrating holes, a part of the flexible board having the at least one plated wall is separable from the second die by receiving an internal force.