Large-Area Probe Card Flatness via Flexible Circuit Interconnect
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Solution Overview
Problem
Conventional probe cards face issues with flatness and structural problems due to the use of interposers, which lead to misalignment and increased manufacturing costs, especially when dealing with fine pitch contact pads and high temperature variations.
Innovation Solution
A large-area probe card design featuring a ceramic insulation plate with slits for a flexible circuit board to connect contactors to a main substrate, eliminating the need for an interposer and allowing for variable pattern shapes and lengths, thereby improving flatness and reducing production costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If an interposer is used to connect contactors to the main substrate, then electrical connection is achieved, but flatness of the probe card deteriorates and misalignment occurs under thermal variations
Solution Approach 1:
The patent removes the interposer component from the probe card structure entirely. Instead of using an interposer to connect contactors to the main substrate, the patent directly connects contactors mounted on the insulation plate to the main substrate through conductive vias, eliminating the source of flatness deterioration and misalignment issues
Solution Approach 2:
The patent segments the probe card structure into distinct functional layers: contactors mounted on the insulation plate, conductive vias for electrical connection, and the main substrate. This segmentation allows each component to be optimized independently while maintaining overall flatness and alignment
2Reliability
If an interposer is used to connect contactors, then electrical connection is established, but manufacturing cost increases due to complex multi-layer structure
Solution Approach 1:
The patent extracts and eliminates the interposer component, simplifying the manufacturing process. The direct connection approach using conductive vias through the insulation plate reduces the number of manufacturing steps, materials required, and overall complexity compared to multi-layer interposer construction
Solution Approach 2:
The patent merges the functions of the interposer into the insulation plate structure itself by integrating conductive vias directly into the plate. This consolidation eliminates the need for separate interposer manufacturing and assembly, reducing overall manufacturing cost and complexity
3Measurement precision
If the number of probe pins is increased to inspect fine pitch contact pads, then inspection capability is improved, but the total size of the probe card increases constraining spatial conditions
Solution Approach 1:
The patent utilizes the vertical dimension by mounting contactors upright on the insulation plate rather than arranging them only in a planar grid. This three-dimensional arrangement allows for higher pin density within the same footprint, enabling fine pitch inspection without proportionally increasing the probe card's horizontal area
Data Source
AI summary
A large-area probe card and method of manufacturing the same including an insulation plate including at least one contactor formed thereon, a main substrate disposed below the insulation plate, and a flexible signal connector vertically passing through the insulation plate and disposed between the at least one contactor and the main substrate to electrically connect the at least one contactor with the main substrate.