Probe Card Gas Blowing for Semiconductor Testing Temperature Control
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Semiconductor devices face inaccuracies in testing due to residues, contaminants, and temperature discrepancies during fabrication, which existing probing devices fail to adequately address.
Innovation Solution
A probing device with a chuck and a probe card that blows a gas at a predetermined temperature, adjustable in orientation, to support and test semiconductor devices, effectively removing unwanted material and adjusting the device's temperature within a range of -60°C to 300°C.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If testing is performed immediately after fabrication, then productivity is improved, but measurement precision deteriorates due to temperature discrepancies
Solution Approach 1:
The patent applies preliminary action by pre-heating or pre-cooling the semiconductor device to the target temperature before testing begins. The temperature control unit adjusts the device temperature in advance, ensuring the device reaches the required test temperature prior to measurement, thus eliminating temperature-induced accuracy errors while maintaining fast testing throughput
2Manufacturing precision
If gas blowing is used to remove contaminants, then purity is improved, but device complexity increases due to additional components
Solution Approach 1:
The patent merges the gas blowing function directly into the probe card structure by integrating gas outlets into the probe card body. This combination eliminates the need for separate gas delivery systems and integrates contaminant removal with the existing probing mechanism, thereby improving purity without significantly increasing overall device complexity
Solution Approach 2:
The probe card is designed with multi-functionality by incorporating both electrical probing contacts and gas blowing outlets in a single component. This universal design allows the probe card to simultaneously perform electrical testing and contaminant removal functions, improving manufacturing precision while avoiding additional dedicated components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution ensures accurate testing by removing contaminants and adjusting the semiconductor device's temperature efficiently, enhancing the precision and reliability of the testing process.
Implementation Method 1
an outlet connected to the inlet and configured to blow the gas from the probe card toward the device under test
Implementation Method 2
blows a gas at a predetermined temperature... adjusting the device's temperature within a range of -60°C to 300°C
Implementation Method 3
blow the gas from the probe card toward the device under test... removing contaminants
Data Source
Figure 1
Figure 2
Figure 3
AI summary
A probing device includes a chuck configured to support a device under test (DUT), and includes a probe card disposed above the chuck. The probe card includes an inlet configured to convey a gas into the probe card, and an outlet configured to blow the gas at a predetermined temperature from the probe card toward the chuck. A method includes providing a chuck, a DUT disposed on the chuck and a probe card disposed above the DUT, and blowing a gas at a predetermined temperature from the probe card toward the DUT.