Probe Card Grounding Layout for Stable High-Speed Signal Testing

The patent introduces a multi-layer structure with first and second guide plates positioned at different heights (Z-dimension), creating three-dimensional grounding points. The first guide plate contains through holes for signal probes, while the second guide plate contains through holes for grounding elements, allowing grounding elements to be positioned closer to the device under test in the vertical dimension while maintaining electrical connectivity through conductive traces on both plates.

The patent uses conductive traces as intermediary elements that electrically connect the grounding elements on the second guide plate to the grounding points near the device under test. These traces act as conductive pathways that bridge the gap between the grounding elements and the signal probes, enabling effective grounding without requiring direct physical contact between grounding elements and the device under test.

The patent divides the grounding structure into multiple independent components: first guide plate, second guide plate, conductive traces, signal probes, and grounding elements. Each component has a specific function and can be independently designed and positioned. The first guide plate handles signal transmission, while the second guide plate handles grounding, allowing for modular optimization of each segment to achieve short grounding distances without overwhelming structural complexity.

The patent implements a nested configuration where the second guide plate is positioned below the first guide plate, and both are integrated within the probe card device structure. The conductive traces are embedded within or on the surfaces of the guide plates, creating a compact nested arrangement that achieves short grounding distances while maintaining organizational simplicity through hierarchical structuring.