Probe Card Guide Board Heat Dissipation for Probe Protection
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Solution Overview
Problem
Conventional probe card devices inadequately dissipate thermal energy generated by probes, leading to potential damage or burnout of probes generating higher thermal energy.
Innovation Solution
The probe card device incorporates a heat-dissipation configuration with a first and second guide board module, each equipped with thermal conductors and covering layers, increasing the heat-dissipation area of conductive probes through the use of first and second heat-dissipation units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If probes are designed to generate larger thermal energy, then testing capability is improved, but probe reliability deteriorates due to damage or burnout
Solution Approach 1:
The patent introduces a new spatial dimension for heat dissipation by placing heat-dissipating structures (thermal conductors and covering layers) on guide boards beneath the probes. This transforms the heat dissipation pathway from a one-dimensional probe surface to a two-dimensional extended structure, allowing probes to generate higher thermal energy without compromising reliability.
Solution Approach 2:
The patent introduces thermal conductors as intermediary elements between the probes and the covering layers. These thermal conductors act as mediators that efficiently transfer thermal energy from the probes to the larger heat-dissipating covering layers, enabling the probes to operate at higher power levels without direct exposure to thermal damage.
2Reliability
If heat-dissipation area is increased through additional structures, then probe protection is improved, but device complexity increases
Solution Approach 1:
The guide boards serve multiple functions: they provide mechanical support for the probes, conduct thermal energy away from the probes, and house the heat-dissipating structures. This multi-functionality allows the patent to improve probe protection without proportionally increasing device complexity, as the same structural elements perform multiple roles.
Solution Approach 2:
The patent merges the heat-dissipating functions into the existing guide board structure rather than adding separate dedicated heat dissipation components. The thermal conductors and covering layers are integrated with the guide boards, combining structural support and thermal management functions into a unified system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The enhanced heat-dissipation configuration effectively prevents conductive probes from burning or being damaged by exponentially increasing their heat-dissipation area, ensuring probe integrity and functionality.
Implementation Method 1
The at least one first thermal conductor is connected in-between the two first covering layers and is formed in at least one of the first thru-holes of the one of the two first guide boards... enabling the first heat-dissipation unit and the second heat-dissipation unit to transmit and dissipate a thermal energy generated from the at least one of the conductive probes
Data Source
AI summary
A guide board module of a probe card device includes two first guide boards, a first spacing sheet sandwiched between the two first guide boards, and a first heat-dissipation unit. Each of the two first guide boards has two first board surfaces respectively arranged on two opposite sides thereof and a plurality of first thru-holes penetrating therethrough. The first heat-dissipation unit includes two first covering layers and a first thermal conductor. The first covering layers are respectively formed on the two first board surfaces of one of the two first guide boards. A sum of areas of the two first covering layers is at least 50% of a sum of areas of the two first board surfaces. The first thermal conductor is connected in-between the two first covering layers and is formed in one of the first thru-holes of the corresponding first guide board.