Probe Card Temperature Control via Segmented Heaters
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Solution Overview
Problem
Conventional probe cards face challenges in maintaining uniform temperature distribution during high-temperature testing of semiconductor chips, leading to potential deviations in probe contact and increased risk of substrate cracking due to non-uniform heating and radiant heat effects.
Innovation Solution
The probe card is designed with multiple heater regions and corresponding temperature sensors, allowing for precise control of temperature distribution through individual heating and feedback control, with a heat insulating member to manage heat transfer between regions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a single heater is used to heat the probe card to match the semiconductor wafer temperature, then the contact position deviation is reduced, but the temperature distribution becomes non-uniform causing substrate cracking risk
Solution Approach 1:
The probe card is divided into multiple heater regions (first, second, third heater regions) with independent heating control. Each region can be heated to different temperatures or at different rates, allowing uniform temperature distribution across the entire probe card surface while preventing localized overheating that causes substrate cracking.
Solution Approach 2:
Different regions of the probe card are equipped with independent heating control to address local temperature requirements. The heater regions are positioned to correspond with areas requiring temperature control, enabling precise local temperature management while maintaining overall uniformity.
2Temperature
If the semiconductor wafer is heated by a built-in heater in the XYZ stage, then high-temperature testing is enabled, but radiant heat causes non-uniform temperature distribution on the probe card
Solution Approach 1:
The probe card is pre-heated using its own built-in heater regions before the semiconductor wafer heating begins. This preliminary heating action ensures the probe card reaches the required temperature uniformly, compensating for the radiant heat effects that will occur during subsequent wafer heating.
Solution Approach 2:
Temperature sensors are positioned to detect temperatures at multiple locations on the probe card, and the heater regions are controlled based on this feedback to maintain uniform temperature distribution during high-temperature testing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures uniform temperature distribution across the probe card, preventing deviations in probe contact and reducing the risk of substrate cracking, thereby enhancing the reliability and accuracy of high-temperature testing.
Implementation Method 1
a plurality of first heaters, at least one of which is arranged in each of the heater regions
Implementation Method 2
a plurality of temperature sensors arranged corresponding to each of the plurality of heater regions
Implementation Method 3
a heat insulating member arranged at a part corresponding to a boundary between the heater regions in the supporting substrate
Data Source
AI summary
A probe card having uniform temperature distribution under control to a desired temperature is provided, so as to provide an inspection apparatus and an inspection method. The probe card includes a supporting substrate, a wiring layer arranged including a wiring on a main surface of the supporting substrate, a probe arranged on a surface serving as an opposite side to a side of the supporting substrate of the wiring layer so as to be connected to the wiring, and a plurality of heaters. Further, the probe card is virtually divided into heater regions according to a plurality of heater regions arrayed in vertical and horizontal directions in plan view, and at least one of a plurality of heaters is arranged in each of the plurality of heater regions. An inspection apparatus is configured including the probe card, and an object to be inspected is inspected by use of the inspection apparatus.