Probe Card Heating Element Segmentation for IC Testing
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Solution Overview
Problem
Conventional integrated circuit testing apparatuses face inefficiencies due to slow temperature adjustment of probe cards, leading to reduced test efficiency and interference with test signals from heating power.
Innovation Solution
A probe card system with a heating element and sensors that dynamically adjust heating power based on the proximity of the integrated circuit and the temperature of the probe card, ensuring rapid temperature stabilization and minimizing signal interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single metal layer is provided in the probe base plate as a heating element, then the structure is simple, but it takes a long time for the probe card to be heated to a given temperature, so that its operating efficiency is low
Solution Approach 1:
The heating element is divided into multiple metal layers (first metal layer and second metal layer) instead of using a single layer. This segmentation allows heat to be generated at multiple levels simultaneously, increasing the overall heating efficiency and reducing the time required to reach the target temperature.
Solution Approach 2:
The heating function is extended from a single-plane approach to a multi-layer three-dimensional structure. By adding another metal layer for heating, the system utilizes vertical dimension to distribute heat generation throughout the probe base plate, thereby improving heating speed without significantly increasing complexity.
2Temperature
If power for heating is supplied to a heater though the test signals are fed to an integrated circuit, then the heating function is provided, but the test signals are greatly affected by the power for heating, so that accurate test results cannot be obtained
Solution Approach 1:
The probe base plate is divided into functionally separate regions: a first region for receiving test signals and a second region for receiving heating power. This spatial segmentation prevents electrical interference between test signals and heating power, allowing accurate testing while maintaining effective heating capability.
Solution Approach 2:
The heating function is extracted from the test signal path by providing a separate heating element in the second region that is electrically isolated from the test signal input region. This extraction eliminates the interference between heating power and test signals, ensuring measurement precision is maintained.
3Ease of operation
If the probe card is exposed to ambient temperature whenever the stage is separated from the probe card, then the probe card can be accessed, but the temperature of the probe card lowers, so that re-heating takes a long time
Solution Approach 1:
The heating element is activated in advance when the stage is separated from the probe card, before the next testing operation begins. This preliminary heating action compensates for the temperature loss during exposure to ambient temperature, ensuring the probe card reaches the required temperature quickly without delaying the overall testing schedule.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system effectively heats the probe card to match the thermal expansion rate of the integrated circuit, significantly improving test efficiency and reducing signal interference from heating power.
Implementation Method 1
a heating element disposed on the probe base plate so as to generate heat by power for heating supplied through the power supply path
Implementation Method 2
the integrated circuit and the probe base plate are thermally expanded
Data Source
AI summary
An embodiment of a method for testing an integrated circuit comprises a first step for determining at least one of a group selected from whether or not the chuck top receiving the integrated circuit exists near a probe card which transmits and receives electrical signals to and from the integrated circuit, whether or not the integrated circuit is under testing, and whether or not the probe card has a given temperature, and a second step for adjusting power for heating to be supplied to a heating element provided in the probe card according to the determination result in the first step.