Probe Card Interconnected Holder Differential Soldering
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Solution Overview
Problem
Conventional probe card devices face damage to conductive pads and internal circuitry during the desoldering of probe needles, making reinstallation challenging and potentially damaging the test circuitry board.
Innovation Solution
A probe card device with flexible probe needles and interconnected holders, where the probe needles are indirectly connected to the testing circuitry board through holders with different soldering melting points, allowing controlled desoldering to prevent damage, using a desoldering tool to maintain a temperature below the second desoldering melting point to safely remove the probe needles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If probe needles are directly soldered to the test circuitry board for direct electrical connection, then electrical connectivity is achieved, but the conductive pads and internal circuitry are vulnerable to damage during desoldering operations
Solution Approach 1:
The patent introduces an interconnected holder as an intermediary component between the probe needle and the test circuitry board. This holder serves as a mediator that absorbs the thermal stress during desoldering operations, protecting the conductive pads and internal circuitry from direct heat exposure while maintaining electrical connectivity through the holder's conductive structure
2Ease of operation
If high temperature is applied during desoldering to remove probe needles from the test circuitry board, then the probe needles can be removed, but the excessive heat may damage the conductive pads or internal circuitry of the test circuitry board
Solution Approach 1:
The patent segments the electrical connection into two separate soldering portions: a first soldering portion connecting the probe needle to the holder, and a second soldering portion connecting the holder to the test circuitry board. This segmentation allows selective desoldering of the first portion at lower temperatures, enabling probe needle removal without exposing the test circuitry board to excessive heat
3Ease of manufacture
If the same soldering material is used for both probe needle and circuitry board connections, then manufacturing is simplified, but the probe needles cannot be selectively removed without affecting the circuitry board connections
Solution Approach 1:
The patent applies local quality by using different soldering materials with different melting points at different locations: the first soldering portion uses a low-melting-point material for easy probe needle removal, while the second soldering portion uses a high-melting-point material to secure the holder to the test circuitry board. This localized differentiation enables selective desoldering while maintaining overall manufacturing efficiency
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the risk of damage to the conductive pads and internal circuitry of the test circuitry board during probe needle removal and reinstallation, enabling safe and efficient replacement of probe needles without causing excessive heat damage.
Implementation Method 1
The first soldering portion has a first desoldering melting point. The second soldering portion is different from the first soldering portion, and the second soldering portion has a second desoldering melting point which is higher than the first desoldering melting point.
Data Source
AI summary
A probe card device includes a testing circuitry board, a flexible probe needle, a first solder portion, a second solder portion and an interconnected holder electrically connected to the testing circuitry board and the flexible probe needle in which one end of the interconnected holder is coupled to the flexible probe needle with the first solder portion, and the other end of the interconnected holder is coupled to a conductive pad of the testing circuitry board with the second solder portion. A first desoldering melting point of the first solder portion is higher than a second desoldering melting point of the second solder portion.