Probe Card Holding Apparatus Back Surface Support

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Solution Overview

Problem

Existing electronic device test apparatuses face issues with deformation of probe cards due to increased pushing force required for simultaneous measurements, leading to unstable electrical contact and contact failures, and require multiple stiffeners for varying wafer thicknesses, increasing costs and handling difficulties.

Innovation Solution

An electronic device test apparatus with an abutting mechanism that extends towards the back surface of a performance board, allowing direct receipt of pushing force and automatic adjustment for varying board thicknesses, preventing deformation and ensuring stable contact through a fixing mechanism.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If the number of probe needles is increased for simultaneous measurements, then the measurement capability is improved, but the pushing force increases causing probe card deformation

Engineering Contradiction:

Improvesimultaneous measurements capabilityVSAvoidprobe card deformation

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The invention introduces a new spatial dimension by adding an abutting means that contacts the back surface of the probe card, perpendicular to the front surface where probe needles are located. This distributes the supporting function across both surfaces, allowing the probe card to withstand increased pushing forces from multiple probe needles without deforming the front surface where electrical contact occurs.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Reliability

If a stiffener is added to prevent probe card deformation, then the structural stability is improved, but the cost and weight increase obstructing handling

Engineering Contradiction:

Improveprobe card stabilityVSAvoidhandling convenience

Core Design Contradiction:

ReliabilityVSEase of operation

Solution Approach 1:

The invention extracts the deformation prevention function from the probe card structure itself (removing the need for stiffeners integrated into the probe card) and implements it separately through the abutting means that contacts the back surface. This separation allows the probe card to remain lightweight and easy to handle while still providing the necessary structural support during testing.

Inventive Principle:

Principle #2Taking out (Extraction)

3Adaptability or versatility

If multiple types of stiffeners are prepared for different wafer thicknesses, then the adaptability is improved, but the device complexity and handling difficulty increase

Engineering Contradiction:

Improvecompatibility with different wafer typesVSAvoidnumber of stiffener types

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The invention creates a universal solution where the abutting means can adapt to different wafer and probe card thickness combinations through a single standardized interface. The abutting means provides consistent back-surface support regardless of the specific thickness variations, eliminating the need for multiple specialized stiffener types while maintaining compatibility across different device configurations.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS8710855B2Probe card holding apparatus with probe card engagement structure

Publication Date: 2014.04.29 ADVANTEST CORP

AI summary

A probe card holding apparatus is provided and may be configured to hold a probe card in a test head. The probe card may include a clamp head formed at a center part of a back surface of the probe card, and a holding device provided at the test head and configured to engage with the clamp head.