Probe Card Handling with Intermediary Holding Device
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Solution Overview
Problem
The existing substrate inspection apparatuses face challenges in handling probe cards with multiple contact probes, as there is limited space for operators to grasp, leading to potential damage or bending of contact probes during loading.
Innovation Solution
A substrate inspection apparatus and method that utilize a transfer mounting table with a supporting member and a holding device to securely fasten and transfer probe cards, preventing contact with the base member and minimizing the risk of bending the contact probes during loading.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple contact probes are arranged on the probe card to inspect multiple semiconductor devices simultaneously, then inspection productivity is improved, but the area available for operator handling deteriorates
Solution Approach 1:
A holding device with a holding portion is introduced as an intermediary between the operator and the probe card. The holding portion has an opening that fits over the base member, allowing operators to grasp and manipulate the probe card through the holding device without directly contacting the contact probes. This mediator enables safe handling while maintaining the multi-probe configuration for high productivity
2Device complexity
If the probe card is designed with a simple configuration for easy transfer, then device complexity is reduced, but operator handling capability deteriorates
Solution Approach 1:
The system is segmented into distinct functional components: the probe card with contact probes for inspection, the holding device with holding portion for safe manipulation, and the transfer mounting table for positioning. This segmentation allows the probe card itself to remain simple for transfer purposes while the holding device provides the necessary handling interface for operators
3Measurement precision
If contact probes are made longer to reach electrode pads, then measurement capability is improved, but the risk of probe bending during loading increases
Solution Approach 1:
The holding device with the holding portion that fits over the base member provides preliminary protection against probe bending during loading. By securing the probe card in the holding device before transfer to the transfer mounting table, the system prevents accidental contact and bending of the contact probes, thereby protecting probe integrity while maintaining measurement capability
Data Source
AI summary
A wafer inspection apparatus 10 includes a middle plate 22 that mounts a probe card 18 in which multiple contact probes 20 are provided; a drawer type table 21 in which the middle plate 22 is provided; a tester 15 to which the probe card 18 is mounted; and a transfer robot 17 that transfers the middle plate 22. The middle plate 22 includes a base 23 and multiple supports 24 protruding toward the probe card 18 to be mounted. A protruding height of each support 24 is equal to or higher than a protruding length of the contact probe 20 from the probe card 18. The probe card 18 is fastened to a probe card cover 29 when the probe card 18 is mounted on the middle plate 22, and the transfer robot 17 transfers the middle plate 22 from the table 21 to the tester 15.